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Title: Microelectronic superconducting crossover and coil

Abstract

A microelectronic component comprising a crossover is provided comprising a substrate, a first high T.sub.c superconductor thin film, a second insulating thin film comprising SrTiO.sub.3 ; and a third high T.sub.c superconducting film which has strips which crossover one or more areas of the first superconductor film. An in situ method for depositing all three films on a substrate is provided which does not require annealing steps and which can be opened to the atmosphere between depositions.

Inventors:
 [1];  [2];  [1]
  1. Berkeley, CA
  2. Oakland, CA
Issue Date:
Research Org.:
Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA (United States)
OSTI Identifier:
869173
Patent Number(s):
5291035
Assignee:
Regents of University of California (Oakland, CA)
DOE Contract Number:  
AC03-76SF00098
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
microelectronic; superconducting; crossover; coil; component; comprising; provided; substrate; superconductor; film; insulating; srtio; third; strips; situ; method; depositing; films; require; annealing; steps; atmosphere; depositions; component comprising; superconducting film; provided comprising; annealing steps; film comprising; annealing step; superconductor film; situ method; comprising srtio; microelectronic superconducting; microelectronic component; conducting film; /505/257/

Citation Formats

Wellstood, Frederick C, Kingston, John J, and Clarke, John. Microelectronic superconducting crossover and coil. United States: N. p., 1994. Web.
Wellstood, Frederick C, Kingston, John J, & Clarke, John. Microelectronic superconducting crossover and coil. United States.
Wellstood, Frederick C, Kingston, John J, and Clarke, John. Sat . "Microelectronic superconducting crossover and coil". United States. https://www.osti.gov/servlets/purl/869173.
@article{osti_869173,
title = {Microelectronic superconducting crossover and coil},
author = {Wellstood, Frederick C and Kingston, John J and Clarke, John},
abstractNote = {A microelectronic component comprising a crossover is provided comprising a substrate, a first high T.sub.c superconductor thin film, a second insulating thin film comprising SrTiO.sub.3 ; and a third high T.sub.c superconducting film which has strips which crossover one or more areas of the first superconductor film. An in situ method for depositing all three films on a substrate is provided which does not require annealing steps and which can be opened to the atmosphere between depositions.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1994},
month = {1}
}

Works referenced in this record:

Nb multilayer planarization technology for a subnanosecond Josephson 1K-bit RAM
journal, March 1989


In Situ Fabrication of Reproducible YBCO/Au Planar Tunnel Junctions with an Artificial MgO Barrier
journal, March 1990


Tunneling Characteristics of YBaCuO/MgO/Pb Planar Tunnel Junctions and Observation of Josephson Effect
journal, April 1990


Experimental study of the RSFQ logic elements
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Laser patterning of metal oxide superconductor films by reactive solid-state transformation
journal, February 1988


Deposition of superconducting Y‐Ba‐Cu‐O films at 400 °C without post‐annealing
journal, July 1988


Planar coupling scheme for ultra low noise DC SQUIDs
journal, January 1981


Process test chip for Josephson integrated circuits
journal, January 1981