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Title: Gas filled panel insulation

Abstract

A structural or flexible highly insulative panel which may be translucent, is formed from multi-layer polymeric material in the form of an envelope surrounding a baffle. The baffle is designed so as to minimize heat transfer across the panel, by using material which forms substantially closed spaces to suppress convection of the low conductivity gas fill. At least a portion of the baffle carries a low emissivity surface for suppression of infrared radiation.

Inventors:
 [1];  [2];  [3]
  1. (Berkeley, CA)
  2. (Oakland, CA)
  3. (Piedmont, CA)
Issue Date:
Research Org.:
Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA
OSTI Identifier:
869066
Patent Number(s):
5270092
Assignee:
Regents, University of California (Oakland, CA) LBNL
DOE Contract Number:  
AC03-76SF00098
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
gas; filled; panel; insulation; structural; flexible; highly; insulative; translucent; formed; multi-layer; polymeric; material; form; envelope; surrounding; baffle; designed; minimize; heat; transfer; forms; substantially; closed; spaces; suppress; convection; conductivity; fill; portion; carries; emissivity; surface; suppression; infrared; radiation; gas filled; polymeric material; heat transfer; infrared radiation; substantially closed; gas fill; closed spaces; substantially close; /428/52/

Citation Formats

Griffith, Brent T., Arasteh, Dariush K., and Selkowitz, Stephen E. Gas filled panel insulation. United States: N. p., 1993. Web.
Griffith, Brent T., Arasteh, Dariush K., & Selkowitz, Stephen E. Gas filled panel insulation. United States.
Griffith, Brent T., Arasteh, Dariush K., and Selkowitz, Stephen E. Fri . "Gas filled panel insulation". United States. https://www.osti.gov/servlets/purl/869066.
@article{osti_869066,
title = {Gas filled panel insulation},
author = {Griffith, Brent T. and Arasteh, Dariush K. and Selkowitz, Stephen E.},
abstractNote = {A structural or flexible highly insulative panel which may be translucent, is formed from multi-layer polymeric material in the form of an envelope surrounding a baffle. The baffle is designed so as to minimize heat transfer across the panel, by using material which forms substantially closed spaces to suppress convection of the low conductivity gas fill. At least a portion of the baffle carries a low emissivity surface for suppression of infrared radiation.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1993},
month = {1}
}

Patent:

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