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Title: High thermal expansion, sealing glass

Abstract

A glass composition for hermetically sealing to high thermal expansion materials such as aluminum alloys, stainless steels, copper, and copper/beryllium alloys, which includes between about 10 and about 25 mole percent Na.sub.2 O, between about 10 and about 25 mole percent K.sub.2 O, between about 5 and about 15 mole percent Al.sub.2 O.sub.3, between about 35 and about 50 mole percent P.sub.2 O.sub.5 and between about 5 and about 15 mole percent of one of PbO, BaO, and mixtures thereof. The composition, which may also include between 0 and about 5 mole percent Fe.sub.2 O.sub.3 and between 0 and about 10 mole percent B.sub.2 O.sub.3, has a thermal expansion coefficient in a range of between about 160 and 210.times.10-7/.degree.C. and a dissolution rate in a range of between about 2.times.10.sup.- 7 and 2.times.10.sup.-9 g/cm.sup.2 -min. This composition is suitable to hermetically seal to metallic electrical components which will be subjected to humid environments over an extended period of time.

Inventors:
 [1];  [1]
  1. (Albuquerque, NM)
Issue Date:
Research Org.:
AT & T CORP
OSTI Identifier:
869016
Patent Number(s):
5262364
Assignee:
United States of America as represented by United States (Washington, DC) SNL
DOE Contract Number:  
AC04-76DP00789
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
thermal; expansion; sealing; glass; composition; hermetically; materials; aluminum; alloys; stainless; steels; copper; beryllium; 10; 25; mole; percent; na; 15; 35; 50; pbo; bao; mixtures; coefficient; range; 160; 210; times; 10-7; degree; dissolution; rate; -9; cm; -min; suitable; seal; metallic; electrical; components; subjected; humid; environments; extended; period; time; hermetically sealing; stainless steels; electrical components; expansion coefficient; thermal expansion; stainless steel; mole percent; glass composition; aluminum alloy; aluminum alloys; extended period; sealing glass; percent na; hermetically seal; expansion materials; metallic electrical; electrical component; /501/

Citation Formats

Brow, Richard K., and Kovacic, Larry. High thermal expansion, sealing glass. United States: N. p., 1993. Web.
Brow, Richard K., & Kovacic, Larry. High thermal expansion, sealing glass. United States.
Brow, Richard K., and Kovacic, Larry. Fri . "High thermal expansion, sealing glass". United States. https://www.osti.gov/servlets/purl/869016.
@article{osti_869016,
title = {High thermal expansion, sealing glass},
author = {Brow, Richard K. and Kovacic, Larry},
abstractNote = {A glass composition for hermetically sealing to high thermal expansion materials such as aluminum alloys, stainless steels, copper, and copper/beryllium alloys, which includes between about 10 and about 25 mole percent Na.sub.2 O, between about 10 and about 25 mole percent K.sub.2 O, between about 5 and about 15 mole percent Al.sub.2 O.sub.3, between about 35 and about 50 mole percent P.sub.2 O.sub.5 and between about 5 and about 15 mole percent of one of PbO, BaO, and mixtures thereof. The composition, which may also include between 0 and about 5 mole percent Fe.sub.2 O.sub.3 and between 0 and about 10 mole percent B.sub.2 O.sub.3, has a thermal expansion coefficient in a range of between about 160 and 210.times.10-7/.degree.C. and a dissolution rate in a range of between about 2.times.10.sup.- 7 and 2.times.10.sup.-9 g/cm.sup.2 -min. This composition is suitable to hermetically seal to metallic electrical components which will be subjected to humid environments over an extended period of time.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1993},
month = {1}
}

Patent:

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