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Title: High adherence copper plating process

Abstract

A process for applying copper to a substrate of aluminum or steel by electrodeposition and for preparing an aluminum or steel substrate for electrodeposition of copper. Practice of the invention provides good adhesion of the copper layer to the substrate.

Inventors:
 [1]
  1. (Tesuque, NM)
Issue Date:
Research Org.:
Los Alamos National Laboratory (LANL), Los Alamos, NM
OSTI Identifier:
868932
Patent Number(s):
5246565
Assignee:
United States of America as represented by United States (Washington, DC) LANL
DOE Contract Number:  
W-7405-ENG-36
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
adherence; copper; plating; process; applying; substrate; aluminum; steel; electrodeposition; preparing; practice; provides; adhesion; layer; steel substrate; copper layer; copper plating; plating process; /205/

Citation Formats

Nignardot, Henry. High adherence copper plating process. United States: N. p., 1993. Web.
Nignardot, Henry. High adherence copper plating process. United States.
Nignardot, Henry. Fri . "High adherence copper plating process". United States. https://www.osti.gov/servlets/purl/868932.
@article{osti_868932,
title = {High adherence copper plating process},
author = {Nignardot, Henry},
abstractNote = {A process for applying copper to a substrate of aluminum or steel by electrodeposition and for preparing an aluminum or steel substrate for electrodeposition of copper. Practice of the invention provides good adhesion of the copper layer to the substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1993},
month = {1}
}

Patent:

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