Three dimensional, multi-chip module

Bernhardt, Anthony F; Petersen, Robert W

Title: Three dimensional, multi-chip module

Abstract

A plurality of multi-chip modules are stacked and bonded around the perimeter by sold-bump bonds to adjacent modules on, for instance, three sides of the perimeter. The fourth side can be used for coolant distribution, for more interconnect structures, or other features, depending on particular design considerations of the chip set. The multi-chip modules comprise a circuit board, having a planarized interconnect structure formed on a first major surface, and integrated circuit chips bonded to the planarized interconnect surface. Around the periphery of each circuit board, long, narrow "dummy chips" are bonded to the finished circuit board to form a perimeter wall. The wall is higher than any of the chips on the circuit board, so that the flat back surface of the board above will only touch the perimeter wall. Module-to-module interconnect is laser-patterned o the sides of the boards and over the perimeter wall in the same way and at the same time that chip to board interconnect may be laser-patterned.

Inventors:

Bernhardt, Anthony F ^[1]; Petersen, Robert W ^[2]

Berkeley, CA
Pleasanton, CA

Issue Date:: 1993-01-01

Research Org.:: Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)

OSTI Identifier:: 868907

Patent Number(s):: 5241450

Assignee:: United States of America as represented by United States (Washington, DC)

Patent Classifications (CPCs):: H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

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H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L2924/3511 - Warping
H01L23/473 - by flowing liquids {
H01L2924/01322 - Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
H01L2924/3011 - Impedance
H01L2924/00 - Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/1627 - stacked type assemblies, e.g. stacked multi-cavities
H01L24/24 - {of an individual high density interconnect connector}
H01L23/5385 - {Assembly of a plurality of insulating substrates}
H01L2924/15787 - Ceramics, e.g. crystalline carbides, nitrides or oxides

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K7/023 - {Stackable modules}

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L2924/14 - Integrated circuits
H01L25/105 - {the devices being of a type provided for in group H01L27/00}
H01L2924/12042 - LASER

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DOE Contract Number:: W-7405-ENG-48

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: dimensional; multi-chip; module; plurality; modules; stacked; bonded; perimeter; sold-bump; bonds; adjacent; instance; fourth; coolant; distribution; interconnect; structures; features; depending; particular; design; considerations; chip; set; comprise; circuit; board; planarized; structure; formed; major; surface; integrated; chips; periphery; narrow; dummy; finished; form; wall; flat; touch; module-to-module; laser-patterned; boards; time; multi-chip modules; structure formed; circuit board; integrated circuit; major surface; circuit chip; adjacent modules; interconnect structure; circuit chips; multi-chip module; modules comprise; adjacent module; /361/257/

Citation Formats


                    Bernhardt, Anthony F, and Petersen, Robert W. Three dimensional, multi-chip module.  United States: N. p., 1993. 
        Web.

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                    Bernhardt, Anthony F, & Petersen, Robert W. Three dimensional, multi-chip module.  United States.

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                    Bernhardt, Anthony F, and Petersen, Robert W. Fri .  
        "Three dimensional, multi-chip module".  United States.  https://www.osti.gov/servlets/purl/868907.

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@article{osti_868907,

  title        = {Three dimensional, multi-chip module},

  author       = {Bernhardt, Anthony F and Petersen, Robert W},

  abstractNote = {A plurality of multi-chip modules are stacked and bonded around the perimeter by sold-bump bonds to adjacent modules on, for instance, three sides of the perimeter. The fourth side can be used for coolant distribution, for more interconnect structures, or other features, depending on particular design considerations of the chip set. The multi-chip modules comprise a circuit board, having a planarized interconnect structure formed on a first major surface, and integrated circuit chips bonded to the planarized interconnect surface. Around the periphery of each circuit board, long, narrow "dummy chips" are bonded to the finished circuit board to form a perimeter wall. The wall is higher than any of the chips on the circuit board, so that the flat back surface of the board above will only touch the perimeter wall. Module-to-module interconnect is laser-patterned o the sides of the boards and over the perimeter wall in the same way and at the same time that chip to board interconnect may be laser-patterned.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {1993},

  month        = {1}

}

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Works referenced in this record:

Narrow Channel Forced Air Heat Sink
journal, March 1984

Goldberg, N.
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 7, Issue 1
https://doi.org/10.1109/TCHMT.1984.1136326

High-performance heat sinking for VLSI
journal, May 1981

Tuckerman, D. B.; Pease, R. F. W.
IEEE Electron Device Letters, Vol. 2, Issue 5
https://doi.org/10.1109/EDL.1981.25367

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Title: Three dimensional, multi-chip module

Abstract

Citation Formats

Narrow Channel Forced Air Heat Sink journal, March 1984

High-performance heat sinking for VLSI journal, May 1981

Narrow Channel Forced Air Heat Sink
journal, March 1984

High-performance heat sinking for VLSI
journal, May 1981