Three dimensional, multi-chip module
Abstract
A plurality of multi-chip modules are stacked and bonded around the perimeter by sold-bump bonds to adjacent modules on, for instance, three sides of the perimeter. The fourth side can be used for coolant distribution, for more interconnect structures, or other features, depending on particular design considerations of the chip set. The multi-chip modules comprise a circuit board, having a planarized interconnect structure formed on a first major surface, and integrated circuit chips bonded to the planarized interconnect surface. Around the periphery of each circuit board, long, narrow "dummy chips" are bonded to the finished circuit board to form a perimeter wall. The wall is higher than any of the chips on the circuit board, so that the flat back surface of the board above will only touch the perimeter wall. Module-to-module interconnect is laser-patterned o the sides of the boards and over the perimeter wall in the same way and at the same time that chip to board interconnect may be laser-patterned.
- Inventors:
-
- Berkeley, CA
- Pleasanton, CA
- Issue Date:
- Research Org.:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- OSTI Identifier:
- 868907
- Patent Number(s):
- 5241450
- Assignee:
- United States of America as represented by United States (Washington, DC)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
- DOE Contract Number:
- W-7405-ENG-48
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- dimensional; multi-chip; module; plurality; modules; stacked; bonded; perimeter; sold-bump; bonds; adjacent; instance; fourth; coolant; distribution; interconnect; structures; features; depending; particular; design; considerations; chip; set; comprise; circuit; board; planarized; structure; formed; major; surface; integrated; chips; periphery; narrow; dummy; finished; form; wall; flat; touch; module-to-module; laser-patterned; boards; time; multi-chip modules; structure formed; circuit board; integrated circuit; major surface; circuit chip; adjacent modules; interconnect structure; circuit chips; multi-chip module; modules comprise; adjacent module; /361/257/
Citation Formats
Bernhardt, Anthony F, and Petersen, Robert W. Three dimensional, multi-chip module. United States: N. p., 1993.
Web.
Bernhardt, Anthony F, & Petersen, Robert W. Three dimensional, multi-chip module. United States.
Bernhardt, Anthony F, and Petersen, Robert W. Fri .
"Three dimensional, multi-chip module". United States. https://www.osti.gov/servlets/purl/868907.
@article{osti_868907,
title = {Three dimensional, multi-chip module},
author = {Bernhardt, Anthony F and Petersen, Robert W},
abstractNote = {A plurality of multi-chip modules are stacked and bonded around the perimeter by sold-bump bonds to adjacent modules on, for instance, three sides of the perimeter. The fourth side can be used for coolant distribution, for more interconnect structures, or other features, depending on particular design considerations of the chip set. The multi-chip modules comprise a circuit board, having a planarized interconnect structure formed on a first major surface, and integrated circuit chips bonded to the planarized interconnect surface. Around the periphery of each circuit board, long, narrow "dummy chips" are bonded to the finished circuit board to form a perimeter wall. The wall is higher than any of the chips on the circuit board, so that the flat back surface of the board above will only touch the perimeter wall. Module-to-module interconnect is laser-patterned o the sides of the boards and over the perimeter wall in the same way and at the same time that chip to board interconnect may be laser-patterned.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1993},
month = {1}
}
Works referenced in this record:
Narrow Channel Forced Air Heat Sink
journal, March 1984
- Goldberg, N.
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 7, Issue 1
High-performance heat sinking for VLSI
journal, May 1981
- Tuckerman, D. B.; Pease, R. F. W.
- IEEE Electron Device Letters, Vol. 2, Issue 5