skip to main content
DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Superconducting microcircuitry by the microlithgraphic patterning of superconducting compounds and related materials

Abstract

Superconducting microcircuits including a thin layer of Ba.sub.2 Cu.sub.3 O.sub.5+x (0<1) on a substrate. A thin layer of a dopant; for example, Y.sub.2 O.sub.3 for superconducting patterns of YBa.sub.2 Cu.sub.3 O.sub.7-x, or Pr.sub.2 O.sub.3 for insulator patterns of PrBa.sub.2 Cu.sub.3 O.sub.7-x. These layers are covered with a layer of photoresist, which is exposed to light through a mask having a pattern for a desired circuit. The photoresist is then developed to reveal a pattern of the thin dopant layer which will be etched away. The microcircuit is then etched and stripped to remove the unneeded portion of the thin dopant layer. Finally, the microcircuit is heated at a temperature and for a period of time sufficient to diffuse and react the dopant layer with the thin layer of Ba.sub.2 Cu.sub.3 O.sub.5+x, forming a pattern of superconductor or insulator.

Inventors:
 [1]
  1. Los Alamos, NM
Issue Date:
Research Org.:
Los Alamos National Lab. (LANL), Los Alamos, NM (United States)
OSTI Identifier:
868896
Patent Number(s):
5238913
Assignee:
United States of America as represented by United States (Washington, DC)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10S - TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
DOE Contract Number:  
W-7405-ENG-36
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
superconducting; microcircuitry; microlithgraphic; patterning; compounds; related; materials; microcircuits; including; layer; cu; substrate; dopant; example; patterns; yba; 7-x; insulator; prba; layers; covered; photoresist; exposed; light; mask; pattern; desired; circuit; developed; reveal; etched; microcircuit; stripped; remove; unneeded; portion; finally; heated; temperature; period; time; sufficient; diffuse; react; forming; superconductor; related materials; time sufficient; circuits including; superconducting compounds; desired circuit; /505/204/216/

Citation Formats

Coppa, Nicholas V. Superconducting microcircuitry by the microlithgraphic patterning of superconducting compounds and related materials. United States: N. p., 1993. Web.
Coppa, Nicholas V. Superconducting microcircuitry by the microlithgraphic patterning of superconducting compounds and related materials. United States.
Coppa, Nicholas V. Fri . "Superconducting microcircuitry by the microlithgraphic patterning of superconducting compounds and related materials". United States. https://www.osti.gov/servlets/purl/868896.
@article{osti_868896,
title = {Superconducting microcircuitry by the microlithgraphic patterning of superconducting compounds and related materials},
author = {Coppa, Nicholas V},
abstractNote = {Superconducting microcircuits including a thin layer of Ba.sub.2 Cu.sub.3 O.sub.5+x (0<1) on a substrate. A thin layer of a dopant; for example, Y.sub.2 O.sub.3 for superconducting patterns of YBa.sub.2 Cu.sub.3 O.sub.7-x, or Pr.sub.2 O.sub.3 for insulator patterns of PrBa.sub.2 Cu.sub.3 O.sub.7-x. These layers are covered with a layer of photoresist, which is exposed to light through a mask having a pattern for a desired circuit. The photoresist is then developed to reveal a pattern of the thin dopant layer which will be etched away. The microcircuit is then etched and stripped to remove the unneeded portion of the thin dopant layer. Finally, the microcircuit is heated at a temperature and for a period of time sufficient to diffuse and react the dopant layer with the thin layer of Ba.sub.2 Cu.sub.3 O.sub.5+x, forming a pattern of superconductor or insulator.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1993},
month = {1}
}

Patent:

Save / Share: