skip to main content
DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: High rate chemical vapor deposition of carbon films using fluorinated gases

Abstract

A high rate, low-temperature deposition of amorphous carbon films is produced by PE-CVD in the presence of a fluorinated or other halide gas. The deposition can be performed at less than 100.degree. C., including ambient room temperature, with a radio frequency plasma assisted chemical vapor deposition process. With less than 6.5 atomic percent fluorine incorporated into the amorphous carbon film, the characteristics of the carbon film, including index of refraction, mass density, optical clarity, and chemical resistance are within fifteen percent (15%) of those characteristics for pure amorphous carbon films, but the deposition rates are high.

Inventors:
 [1];  [2];  [2];  [3]
  1. Arvada, CO
  2. Golden, CO
  3. Longmont, CO
Issue Date:
Research Org.:
Midwest Research Institute, Kansas City, MO (United States)
OSTI Identifier:
868715
Patent Number(s):
5198263
Assignee:
United States of America as represented by United States (Washington, DC)
DOE Contract Number:  
S-68,637
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
rate; chemical; vapor; deposition; carbon; films; fluorinated; gases; low-temperature; amorphous; produced; pe-cvd; presence; halide; gas; performed; 100; degree; including; ambient; temperature; radio; frequency; plasma; assisted; process; atomic; percent; fluorine; incorporated; film; characteristics; index; refraction; mass; density; optical; clarity; resistance; fifteen; 15; pure; rates; plasma assisted; assisted chemical; temperature deposition; chemical resistance; amorphous carbon; atomic percent; radio frequency; chemical vapor; vapor deposition; deposition process; carbon film; deposition rate; carbon films; optical clarity; pure amorphous; mass density; deposition rates; halide gas; frequency plasma; low-temperature deposition; /427/

Citation Formats

Stafford, Byron L, Tracy, C Edwin, Benson, David K, and Nelson, Arthur J. High rate chemical vapor deposition of carbon films using fluorinated gases. United States: N. p., 1993. Web.
Stafford, Byron L, Tracy, C Edwin, Benson, David K, & Nelson, Arthur J. High rate chemical vapor deposition of carbon films using fluorinated gases. United States.
Stafford, Byron L, Tracy, C Edwin, Benson, David K, and Nelson, Arthur J. Fri . "High rate chemical vapor deposition of carbon films using fluorinated gases". United States. https://www.osti.gov/servlets/purl/868715.
@article{osti_868715,
title = {High rate chemical vapor deposition of carbon films using fluorinated gases},
author = {Stafford, Byron L and Tracy, C Edwin and Benson, David K and Nelson, Arthur J},
abstractNote = {A high rate, low-temperature deposition of amorphous carbon films is produced by PE-CVD in the presence of a fluorinated or other halide gas. The deposition can be performed at less than 100.degree. C., including ambient room temperature, with a radio frequency plasma assisted chemical vapor deposition process. With less than 6.5 atomic percent fluorine incorporated into the amorphous carbon film, the characteristics of the carbon film, including index of refraction, mass density, optical clarity, and chemical resistance are within fifteen percent (15%) of those characteristics for pure amorphous carbon films, but the deposition rates are high.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1993},
month = {1}
}

Patent:

Save / Share: