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Title: Solder for oxide layer-building metals and alloys

Abstract

A low temperature solder and method for soldering an oxide layer-building metal such as aluminum, titanium, tantalum or stainless steel. The comosition comprises tin and zinc; germanium as a wetting agent; preferably small amounts of copper and antimony; and a grit, such as silicon carbide. The grit abrades any oxide layer formed on the surface of the metal as the germanium penetrates beneath and loosens the oxide layer to provide good metal-to-metal contact. The germanium comprises less than aproximatley 10% by weight of the solder composition so that it provides sufficient wetting action but does not result in a melting temperature above approximately 300.degree. C. The method comprises the steps rubbing the solder against the metal surface so the grit in the solder abrades the surface while heating the surface until the solder begins to melt and the germanium penetrates the oxide layer, then brushing aside any oxide layer loosened by the solder.

Inventors:
 [1]
  1. 108 Independent Blvd., Aiken, SC 29801
Issue Date:
Research Org.:
Savannah River Site (SRS), Aiken, SC (United States)
OSTI Identifier:
868464
Patent Number(s):
5147471
Assignee:
Kronberg, James W. (108 Independent Blvd., Aiken, SC 29801)
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
DOE Contract Number:  
AC09-89SR18035
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
solder; oxide; layer-building; metals; alloys; temperature; method; soldering; metal; aluminum; titanium; tantalum; stainless; steel; comosition; comprises; zinc; germanium; wetting; agent; preferably; amounts; copper; antimony; grit; silicon; carbide; abrades; layer; formed; surface; penetrates; beneath; loosens; provide; metal-to-metal; contact; aproximatley; 10; weight; composition; provides; sufficient; action; result; melting; approximately; 300; degree; steps; rubbing; heating; begins; melt; brushing; aside; loosened; metal contact; provides sufficient; layer formed; metal surface; melting temperature; method comprises; stainless steel; silicon carbide; oxide layer; wetting agent; method comprise; metal-to-metal contact; oxide layer-building; temperature solder; /420/148/

Citation Formats

Kronberg, James W. Solder for oxide layer-building metals and alloys. United States: N. p., 1992. Web.
Kronberg, James W. Solder for oxide layer-building metals and alloys. United States.
Kronberg, James W. Wed . "Solder for oxide layer-building metals and alloys". United States. https://www.osti.gov/servlets/purl/868464.
@article{osti_868464,
title = {Solder for oxide layer-building metals and alloys},
author = {Kronberg, James W},
abstractNote = {A low temperature solder and method for soldering an oxide layer-building metal such as aluminum, titanium, tantalum or stainless steel. The comosition comprises tin and zinc; germanium as a wetting agent; preferably small amounts of copper and antimony; and a grit, such as silicon carbide. The grit abrades any oxide layer formed on the surface of the metal as the germanium penetrates beneath and loosens the oxide layer to provide good metal-to-metal contact. The germanium comprises less than aproximatley 10% by weight of the solder composition so that it provides sufficient wetting action but does not result in a melting temperature above approximately 300.degree. C. The method comprises the steps rubbing the solder against the metal surface so the grit in the solder abrades the surface while heating the surface until the solder begins to melt and the germanium penetrates the oxide layer, then brushing aside any oxide layer loosened by the solder.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1992},
month = {1}
}

Patent:

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