Solder extrusion pressure bonding process and bonded products produced thereby
Abstract
Production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about -40.degree. C. and 110.degree. C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.
- Inventors:
-
- Albuquerque, NM
- Ceder Crest, NM
- Issue Date:
- Research Org.:
- AT&T
- OSTI Identifier:
- 868343
- Patent Number(s):
- 5121871
- Assignee:
- United States of America as represented by United States (Washington, DC)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- AC04-76DP00789
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- solder; extrusion; pressure; bonding; process; bonded; products; produced; production; soldered; joints; highly; reliable; capable; surviving; 10; 000; thermal; cycles; -40; degree; 110; involves; interposing; layer; metal; composition; surfaces; applying; heat; 1000; psi; compression; superposed; presence; reducing; atmosphere; extrude; major; amount; contaminants; including; fluxing; gases; air; form; strong; intermetallic; expansion; tolerant; bonding process; major amount; reducing atmosphere; metal surface; process involves; metal surfaces; thermal expansion; products produced; thermal cycle; metallic bond; bonding layer; applying heat; highly reliable; /228/
Citation Formats
Beavis, Leonard C, Karnowsky, Maurice M, and Yost, Frederick G. Solder extrusion pressure bonding process and bonded products produced thereby. United States: N. p., 1992.
Web.
Beavis, Leonard C, Karnowsky, Maurice M, & Yost, Frederick G. Solder extrusion pressure bonding process and bonded products produced thereby. United States.
Beavis, Leonard C, Karnowsky, Maurice M, and Yost, Frederick G. Wed .
"Solder extrusion pressure bonding process and bonded products produced thereby". United States. https://www.osti.gov/servlets/purl/868343.
@article{osti_868343,
title = {Solder extrusion pressure bonding process and bonded products produced thereby},
author = {Beavis, Leonard C and Karnowsky, Maurice M and Yost, Frederick G},
abstractNote = {Production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about -40.degree. C. and 110.degree. C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Wed Jan 01 00:00:00 EST 1992},
month = {Wed Jan 01 00:00:00 EST 1992}
}
Save to My Library
You must Sign In or Create an Account in order to save documents to your library.
Works referenced in this record: