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Title: Solder extrusion pressure bonding process and bonded products produced thereby

Abstract

Production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about -40.degree. C. and 110.degree. C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.

Inventors:
 [1];  [1];  [2]
  1. Albuquerque, NM
  2. Ceder Crest, NM
Issue Date:
Research Org.:
AT&T Corp., Albuquerque, NM (United States)
OSTI Identifier:
868343
Patent Number(s):
5121871
Assignee:
United States of America as represented by United States (Washington, DC)
DOE Contract Number:  
AC04-76DP00789
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
solder; extrusion; pressure; bonding; process; bonded; products; produced; production; soldered; joints; highly; reliable; capable; surviving; 10; 000; thermal; cycles; -40; degree; 110; involves; interposing; layer; metal; composition; surfaces; applying; heat; 1000; psi; compression; superposed; presence; reducing; atmosphere; extrude; major; amount; contaminants; including; fluxing; gases; air; form; strong; intermetallic; expansion; tolerant; bonding process; major amount; reducing atmosphere; metal surface; process involves; metal surfaces; thermal expansion; products produced; thermal cycle; metallic bond; bonding layer; applying heat; highly reliable; /228/

Citation Formats

Beavis, Leonard C, Karnowsky, Maurice M, and Yost, Frederick G. Solder extrusion pressure bonding process and bonded products produced thereby. United States: N. p., 1992. Web.
Beavis, Leonard C, Karnowsky, Maurice M, & Yost, Frederick G. Solder extrusion pressure bonding process and bonded products produced thereby. United States.
Beavis, Leonard C, Karnowsky, Maurice M, and Yost, Frederick G. Wed . "Solder extrusion pressure bonding process and bonded products produced thereby". United States. https://www.osti.gov/servlets/purl/868343.
@article{osti_868343,
title = {Solder extrusion pressure bonding process and bonded products produced thereby},
author = {Beavis, Leonard C and Karnowsky, Maurice M and Yost, Frederick G},
abstractNote = {Production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about -40.degree. C. and 110.degree. C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1992},
month = {1}
}

Patent:

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