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Title: Process for preparation of a seed layer for selective metal deposition

Abstract

Disclosed is a process for selective metal deposition comprising of the steps of: a. formation of an initial surface on a substrate, said initial surface being comprised of at least two layers of which the uppermost is inert, b. exposing the surface to a source of heat in pre-determined places wherein surface activation is desired, and c. deposition of metal on activated portions of said surface.

Inventors:
 [1]
  1. (Berkeley, CA)
Issue Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
OSTI Identifier:
868202
Patent Number(s):
5098526
Assignee:
United States of America as represented by United States (Washington, DC) LLNL
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
process; preparation; seed; layer; selective; metal; deposition; disclosed; comprising; steps; formation; initial; surface; substrate; comprised; layers; uppermost; inert; exposing; source; heat; pre-determined; activation; desired; activated; portions; metal deposition; seed layer; selective metal; metal deposit; initial surface; activated portion; /205/

Citation Formats

Bernhardt, Anthony F. Process for preparation of a seed layer for selective metal deposition. United States: N. p., 1992. Web.
Bernhardt, Anthony F. Process for preparation of a seed layer for selective metal deposition. United States.
Bernhardt, Anthony F. Wed . "Process for preparation of a seed layer for selective metal deposition". United States. https://www.osti.gov/servlets/purl/868202.
@article{osti_868202,
title = {Process for preparation of a seed layer for selective metal deposition},
author = {Bernhardt, Anthony F.},
abstractNote = {Disclosed is a process for selective metal deposition comprising of the steps of: a. formation of an initial surface on a substrate, said initial surface being comprised of at least two layers of which the uppermost is inert, b. exposing the surface to a source of heat in pre-determined places wherein surface activation is desired, and c. deposition of metal on activated portions of said surface.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1992},
month = {1}
}

Patent:

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