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Title: Method and apparatus for spatially uniform electropolishing and electrolytic etching

Abstract

In an electropolishing or electrolytic etching apparatus the anode is separated from the cathode to prevent bubble transport to the anode and to produce a uniform current distribution at the anode by means of a solid nonconducting anode-cathode barrier. The anode extends into the top of the barrier and the cathode is outside the barrier. A virtual cathode hole formed in the bottom of the barrier below the level of the cathode permits current flow while preventing bubble transport. The anode is rotatable and oriented horizontally facing down. An extended anode is formed by mounting the workpiece in a holder which extends the electropolishing or etching area beyond the edge of the workpiece to reduce edge effects at the workpiece. A reference electrode controls cell voltage. Endpoint detection and current shut-off stop polishing. Spatially uniform polishing or etching can be rapidly performed.

Inventors:
 [1];  [2];  [3]
  1. Piedmont, CA
  2. Pleasanton, CA
  3. Berkeley, CA
Issue Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
OSTI Identifier:
868190
Patent Number(s):
5096550
Assignee:
United States of America as represented by United States (Washington, DC)
Patent Classifications (CPCs):
C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25F - PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10S - TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
method; apparatus; spatially; uniform; electropolishing; electrolytic; etching; anode; separated; cathode; prevent; bubble; transport; produce; current; distribution; means; solid; nonconducting; anode-cathode; barrier; extends; top; outside; virtual; formed; bottom; below; level; permits; flow; preventing; rotatable; oriented; horizontally; facing; extended; mounting; workpiece; holder; edge; reduce; effects; reference; electrode; controls; cell; voltage; endpoint; detection; shut-off; stop; polishing; rapidly; performed; cell voltage; reference electrode; current flow; virtual cathode; edge effects; form cu; current distribution; electrolytic etching; uniform current; /205/204/

Citation Formats

Mayer, Steven T, Contolini, Robert J, and Bernhardt, Anthony F. Method and apparatus for spatially uniform electropolishing and electrolytic etching. United States: N. p., 1992. Web.
Mayer, Steven T, Contolini, Robert J, & Bernhardt, Anthony F. Method and apparatus for spatially uniform electropolishing and electrolytic etching. United States.
Mayer, Steven T, Contolini, Robert J, and Bernhardt, Anthony F. Wed . "Method and apparatus for spatially uniform electropolishing and electrolytic etching". United States. https://www.osti.gov/servlets/purl/868190.
@article{osti_868190,
title = {Method and apparatus for spatially uniform electropolishing and electrolytic etching},
author = {Mayer, Steven T and Contolini, Robert J and Bernhardt, Anthony F},
abstractNote = {In an electropolishing or electrolytic etching apparatus the anode is separated from the cathode to prevent bubble transport to the anode and to produce a uniform current distribution at the anode by means of a solid nonconducting anode-cathode barrier. The anode extends into the top of the barrier and the cathode is outside the barrier. A virtual cathode hole formed in the bottom of the barrier below the level of the cathode permits current flow while preventing bubble transport. The anode is rotatable and oriented horizontally facing down. An extended anode is formed by mounting the workpiece in a holder which extends the electropolishing or etching area beyond the edge of the workpiece to reduce edge effects at the workpiece. A reference electrode controls cell voltage. Endpoint detection and current shut-off stop polishing. Spatially uniform polishing or etching can be rapidly performed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1992},
month = {1}
}

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