Electrochemical method for defect delineation in silicon-on-insulator wafers
Abstract
An electrochemical method for defect delineation in thin-film SOI or SOS wafers in which a surface of a silicon wafer is electrically connected so as to control the voltage of the surface within a specified range, the silicon wafer is then contacted with an electrolyte, and, after removing the electrolyte, defects and metal contamination in the silicon wafer are identified.
- Inventors:
-
- Albuquerque, NM
- Issue Date:
- Research Org.:
- AT&T
- OSTI Identifier:
- 867810
- Patent Number(s):
- 5015346
- Assignee:
- United States Department of Energy (Washington, DC)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23H - WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL
C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25F - PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS
- DOE Contract Number:
- AC04-76DP00789
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- electrochemical; method; defect; delineation; silicon-on-insulator; wafers; thin-film; soi; sos; surface; silicon; wafer; electrically; connected; control; voltage; specified; range; contacted; electrolyte; removing; defects; metal; contamination; identified; metal contamination; electrically connected; silicon wafer; electrochemical method; specified range; chemical method; defect delineation; /205/
Citation Formats
Guilinger, Terry R, Jones, Howland D. T., Kelly, Michael J, Medernach, John W, Stevenson, Joel O, and Tsao, Sylvia S. Electrochemical method for defect delineation in silicon-on-insulator wafers. United States: N. p., 1991.
Web.
Guilinger, Terry R, Jones, Howland D. T., Kelly, Michael J, Medernach, John W, Stevenson, Joel O, & Tsao, Sylvia S. Electrochemical method for defect delineation in silicon-on-insulator wafers. United States.
Guilinger, Terry R, Jones, Howland D. T., Kelly, Michael J, Medernach, John W, Stevenson, Joel O, and Tsao, Sylvia S. Tue .
"Electrochemical method for defect delineation in silicon-on-insulator wafers". United States. https://www.osti.gov/servlets/purl/867810.
@article{osti_867810,
title = {Electrochemical method for defect delineation in silicon-on-insulator wafers},
author = {Guilinger, Terry R and Jones, Howland D. T. and Kelly, Michael J and Medernach, John W and Stevenson, Joel O and Tsao, Sylvia S},
abstractNote = {An electrochemical method for defect delineation in thin-film SOI or SOS wafers in which a surface of a silicon wafer is electrically connected so as to control the voltage of the surface within a specified range, the silicon wafer is then contacted with an electrolyte, and, after removing the electrolyte, defects and metal contamination in the silicon wafer are identified.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1991},
month = {1}
}