Soft x-ray reduction camera for submicron lithography
Abstract
Soft x-ray projection lithography can be performed using x-ray optical components and spherical imaging lenses (mirrors), which form an x-ray reduction camera. The x-ray reduction is capable of projecting a 5x demagnified image of a mask onto a resist coated wafer using 4.5 nm radiation. The diffraction limited resolution of this design is about 135 nm with a depth of field of about 2.8 microns and a field of view of 0.2 cm.sup.2. X-ray reflecting masks (patterned x-ray multilayer mirrors) which are fabricated on thick substrates and can be made relatively distortion free are used, with a laser produced plasma for the source. Higher resolution and/or larger areas are possible by varying the optic figures of the components and source characteristics.
- Inventors:
-
- 2708 Rembrandt Pl., Modesto, CA 95356
- 7911 Mines Rd., Livermore, CA 94550
- Issue Date:
- Research Org.:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- OSTI Identifier:
- 867756
- Patent Number(s):
- 5003567
- Assignee:
- Hawryluk, Andrew M. (2708 Rembrandt Pl., Modesto, CA 95356);Seppala, Lynn G. (7911 Mines Rd., Livermore, CA 94550)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B82 - NANOTECHNOLOGY B82Y - SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES
G - PHYSICS G02 - OPTICS G02B - OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
- DOE Contract Number:
- W-7405-ENG-48
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- soft; x-ray; reduction; camera; submicron; lithography; projection; performed; optical; components; spherical; imaging; lenses; mirrors; form; capable; projecting; 5x; demagnified; image; mask; resist; coated; wafer; nm; radiation; diffraction; limited; resolution; design; 135; depth; field; microns; view; cm; reflecting; masks; patterned; multilayer; fabricated; thick; substrates; relatively; distortion; free; laser; produced; plasma; source; larger; varying; optic; figures; characteristics; laser produced; projection lithography; optical components; soft x-ray; diffraction limited; nm radiation; x-ray reduction; x-ray multilayer; coated wafer; reduction camera; multilayer mirror; resist coated; optical component; distortion free; x-ray optical; x-ray projection; imaging lenses; imaging lens; produced plasma; /378/
Citation Formats
Hawryluk, Andrew M, and Seppala, Lynn G. Soft x-ray reduction camera for submicron lithography. United States: N. p., 1991.
Web.
Hawryluk, Andrew M, & Seppala, Lynn G. Soft x-ray reduction camera for submicron lithography. United States.
Hawryluk, Andrew M, and Seppala, Lynn G. Tue .
"Soft x-ray reduction camera for submicron lithography". United States. https://www.osti.gov/servlets/purl/867756.
@article{osti_867756,
title = {Soft x-ray reduction camera for submicron lithography},
author = {Hawryluk, Andrew M and Seppala, Lynn G},
abstractNote = {Soft x-ray projection lithography can be performed using x-ray optical components and spherical imaging lenses (mirrors), which form an x-ray reduction camera. The x-ray reduction is capable of projecting a 5x demagnified image of a mask onto a resist coated wafer using 4.5 nm radiation. The diffraction limited resolution of this design is about 135 nm with a depth of field of about 2.8 microns and a field of view of 0.2 cm.sup.2. X-ray reflecting masks (patterned x-ray multilayer mirrors) which are fabricated on thick substrates and can be made relatively distortion free are used, with a laser produced plasma for the source. Higher resolution and/or larger areas are possible by varying the optic figures of the components and source characteristics.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1991},
month = {1}
}
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