Soft x-ray reduction camera for submicron lithography

Hawryluk, Andrew M; Seppala, Lynn G

Title: Soft x-ray reduction camera for submicron lithography

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Abstract

Soft x-ray projection lithography can be performed using x-ray optical components and spherical imaging lenses (mirrors), which form an x-ray reduction camera. The x-ray reduction is capable of projecting a 5x demagnified image of a mask onto a resist coated wafer using 4.5 nm radiation. The diffraction limited resolution of this design is about 135 nm with a depth of field of about 2.8 microns and a field of view of 0.2 cm.sup.2. X-ray reflecting masks (patterned x-ray multilayer mirrors) which are fabricated on thick substrates and can be made relatively distortion free are used, with a laser produced plasma for the source. Higher resolution and/or larger areas are possible by varying the optic figures of the components and source characteristics.

Inventors:

Hawryluk, Andrew M ^[1]; Seppala, Lynn G ^[2]

2708 Rembrandt Pl., Modesto, CA 95356
7911 Mines Rd., Livermore, CA 94550

Issue Date:: 1991-01-01

Research Org.:: Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)

OSTI Identifier:: 867756

Patent Number(s):: 5003567

Assignee:: Hawryluk, Andrew M. (2708 Rembrandt Pl., Modesto, CA 95356);Seppala, Lynn G. (7911 Mines Rd., Livermore, CA 94550)

Patent Classifications (CPCs):: B - PERFORMING OPERATIONS B82 - NANOTECHNOLOGY B82Y - SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES

G - PHYSICS G02 - OPTICS G02B - OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS

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B - PERFORMING OPERATIONS B82 - NANOTECHNOLOGY B82Y - SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES
B82Y10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic

G - PHYSICS G02 - OPTICS G02B - OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
G02B17/0621 - {off-axis or unobscured systems in which not all of the mirrors share a common axis of rotational symmetry, e.g. at least one of the mirrors is warped, tilted or decentered with respect to the other elements}

G - PHYSICS G03 - PHOTOGRAPHY G03F - PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES
G03F7/2039 - {X-ray radiation}
G03F7/70033 - {by plasma EUV sources
G03F7/70233 - {Optical aspects of catoptric systems}

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DOE Contract Number:: W-7405-ENG-48

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: soft; x-ray; reduction; camera; submicron; lithography; projection; performed; optical; components; spherical; imaging; lenses; mirrors; form; capable; projecting; 5x; demagnified; image; mask; resist; coated; wafer; nm; radiation; diffraction; limited; resolution; design; 135; depth; field; microns; view; cm; reflecting; masks; patterned; multilayer; fabricated; thick; substrates; relatively; distortion; free; laser; produced; plasma; source; larger; varying; optic; figures; characteristics; laser produced; projection lithography; optical components; soft x-ray; diffraction limited; nm radiation; x-ray reduction; x-ray multilayer; coated wafer; reduction camera; multilayer mirror; resist coated; optical component; distortion free; x-ray optical; x-ray projection; imaging lenses; imaging lens; produced plasma; /378/

Citation Formats


                    Hawryluk, Andrew M, and Seppala, Lynn G. Soft x-ray reduction camera for submicron lithography.  United States: N. p., 1991. 
        Web.

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                    Hawryluk, Andrew M, & Seppala, Lynn G. Soft x-ray reduction camera for submicron lithography.  United States.

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                    Hawryluk, Andrew M, and Seppala, Lynn G. Tue .  
        "Soft x-ray reduction camera for submicron lithography".  United States.  https://www.osti.gov/servlets/purl/867756.

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@article{osti_867756,

  title        = {Soft x-ray reduction camera for submicron lithography},

  author       = {Hawryluk, Andrew M and Seppala, Lynn G},

  abstractNote = {Soft x-ray projection lithography can be performed using x-ray optical components and spherical imaging lenses (mirrors), which form an x-ray reduction camera. The x-ray reduction is capable of projecting a 5x demagnified image of a mask onto a resist coated wafer using 4.5 nm radiation. The diffraction limited resolution of this design is about 135 nm with a depth of field of about 2.8 microns and a field of view of 0.2 cm.sup.2. X-ray reflecting masks (patterned x-ray multilayer mirrors) which are fabricated on thick substrates and can be made relatively distortion free are used, with a laser produced plasma for the source. Higher resolution and/or larger areas are possible by varying the optic figures of the components and source characteristics.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {1991},

  month        = {1}

}

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