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Title: Interconnected semiconductor devices

Abstract

Semiconductor layer and conductive layer formed on a flexible substrate, divided into individual devices and interconnected with one another in series by interconnection layers and penetrating terminals.

Inventors:
 [1];  [2];  [3]
  1. White Bear Lake, MN
  2. North St. Paul, MN
  3. St. Paul, MN
Issue Date:
OSTI Identifier:
867572
Patent Number(s):
4965655
Application Number:
07/388,239
Assignee:
Minnesota Mining and Manufacturing Company (St. Paul, MN)
DOE Contract Number:  
ZB-4-03056-2
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
interconnected; semiconductor; devices; layer; conductive; formed; flexible; substrate; divided; individual; series; interconnection; layers; penetrating; terminals; flexible substrate; layer formed; interconnection layer; semiconductor layer; semiconductor device; semiconductor devices; conductive layer; penetrating terminals; individual devices; interconnection layers; /257/136/

Citation Formats

Grimmer, Derrick P, Paulson, Kenneth R, and Gilbert, James R. Interconnected semiconductor devices. United States: N. p., 1990. Web.
Grimmer, Derrick P, Paulson, Kenneth R, & Gilbert, James R. Interconnected semiconductor devices. United States.
Grimmer, Derrick P, Paulson, Kenneth R, and Gilbert, James R. Tue . "Interconnected semiconductor devices". United States. https://www.osti.gov/servlets/purl/867572.
@article{osti_867572,
title = {Interconnected semiconductor devices},
author = {Grimmer, Derrick P and Paulson, Kenneth R and Gilbert, James R},
abstractNote = {Semiconductor layer and conductive layer formed on a flexible substrate, divided into individual devices and interconnected with one another in series by interconnection layers and penetrating terminals.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1990},
month = {10}
}

Patent:

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