Thin film coating process using an inductively coupled plasma

Kniseley, Richard N; Schmidt, Frederick A; Merkle, Brian D

Title: Thin film coating process using an inductively coupled plasma

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Abstract

Thin coatings of normally solid materials are applied to target substrates using an inductively coupled plasma. Particles of the coating material are vaporized by plasma heating, and pass through an orifice to a first vacuum zone in which the particles are accelerated to a velocity greater than Mach 1. The shock wave generated in the first vacuum zone is intercepted by the tip of a skimmer cone that provides a second orifice. The particles pass through the second orifice into a second zone maintained at a higher vacuum and impinge on the target to form the coating. Ultrapure coatings can be formed.

Inventors:

Kniseley, Richard N ^[1]; Schmidt, Frederick A ^[1]; Merkle, Brian D ^[1]

Ames, IA

Issue Date:: 1990-01-30

Research Org.:: Ames Lab., Ames, IA (United States); Iowa State Univ., Ames, IA (United States)

OSTI Identifier:: 867256

Patent Number(s):: 4897282

Application Number:: 07/199,286

Assignee:: Iowa State University Reserach Foundation, Inc. (Ames, IA)

Patent Classifications (CPCs):: C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL

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C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
C23C4/137 - Spraying in vacuum or in an inert atmosphere

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DOE Contract Number:: W-7405-ENG-82

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: film; coating; process; inductively; coupled; plasma; coatings; normally; solid; materials; applied; target; substrates; particles; material; vaporized; heating; pass; orifice; vacuum; zone; accelerated; velocity; mach; shock; wave; generated; intercepted; tip; skimmer; cone; provides; maintained; impinge; form; ultrapure; formed; zone maintained; coating material; solid materials; inductively coupled; shock wave; solid material; coupled plasma; film coating; target substrate; normally solid; coating process; particles pass; plasma heating; wave generated; target substrates; /427/250/

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                    Kniseley, Richard N, Schmidt, Frederick A, and Merkle, Brian D. Thin film coating process using an inductively coupled plasma.  United States: N. p., 1990. 
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                    Kniseley, Richard N, Schmidt, Frederick A, & Merkle, Brian D. Thin film coating process using an inductively coupled plasma.  United States.

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                    Kniseley, Richard N, Schmidt, Frederick A, and Merkle, Brian D. Tue .  
        "Thin film coating process using an inductively coupled plasma".  United States.  https://www.osti.gov/servlets/purl/867256.

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@article{osti_867256,

  title        = {Thin film coating process using an inductively coupled plasma},

  author       = {Kniseley, Richard N and Schmidt, Frederick A and Merkle, Brian D},

  abstractNote = {Thin coatings of normally solid materials are applied to target substrates using an inductively coupled plasma. Particles of the coating material are vaporized by plasma heating, and pass through an orifice to a first vacuum zone in which the particles are accelerated to a velocity greater than Mach 1. The shock wave generated in the first vacuum zone is intercepted by the tip of a skimmer cone that provides a second orifice. The particles pass through the second orifice into a second zone maintained at a higher vacuum and impinge on the target to form the coating. Ultrapure coatings can be formed.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {1990},

  month        = {1}

}

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