Method for fabricating an interconnected array of semiconductor devices
Abstract
Semiconductor layer and conductive layer formed on a flexible substrate, divided into individual devices and interconnected with one another in series by interconnection layers and penetrating terminals.
- Inventors:
-
- White Bear Lake, MN
- North St. Paul, MN
- St. Paul, MN
- Issue Date:
- OSTI Identifier:
- 867127
- Patent Number(s):
- 4873201
- Application Number:
- 07/131,416
- Assignee:
- Minnesota Mining and Manufacturing Company (St. Paul, MN)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE Y02E - REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- DOE Contract Number:
- ZB-4-03056-2
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- method; fabricating; interconnected; array; semiconductor; devices; layer; conductive; formed; flexible; substrate; divided; individual; series; interconnection; layers; penetrating; terminals; flexible substrate; layer formed; interconnection layer; semiconductor layer; semiconductor device; semiconductor devices; conductive layer; penetrating terminals; individual devices; interconnection layers; /438/136/
Citation Formats
Grimmer, Derrick P, Paulson, Kenneth R, and Gilbert, James R. Method for fabricating an interconnected array of semiconductor devices. United States: N. p., 1989.
Web.
Grimmer, Derrick P, Paulson, Kenneth R, & Gilbert, James R. Method for fabricating an interconnected array of semiconductor devices. United States.
Grimmer, Derrick P, Paulson, Kenneth R, and Gilbert, James R. Tue .
"Method for fabricating an interconnected array of semiconductor devices". United States. https://www.osti.gov/servlets/purl/867127.
@article{osti_867127,
title = {Method for fabricating an interconnected array of semiconductor devices},
author = {Grimmer, Derrick P and Paulson, Kenneth R and Gilbert, James R},
abstractNote = {Semiconductor layer and conductive layer formed on a flexible substrate, divided into individual devices and interconnected with one another in series by interconnection layers and penetrating terminals.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1989},
month = {10}
}