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Title: Method for fabricating an interconnected array of semiconductor devices

Abstract

Semiconductor layer and conductive layer formed on a flexible substrate, divided into individual devices and interconnected with one another in series by interconnection layers and penetrating terminals.

Inventors:
 [1];  [2];  [3]
  1. White Bear Lake, MN
  2. North St. Paul, MN
  3. St. Paul, MN
Issue Date:
OSTI Identifier:
867127
Patent Number(s):
4873201
Application Number:
07/131,416
Assignee:
Minnesota Mining and Manufacturing Company (St. Paul, MN)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE Y02E - REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
DOE Contract Number:  
ZB-4-03056-2
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
method; fabricating; interconnected; array; semiconductor; devices; layer; conductive; formed; flexible; substrate; divided; individual; series; interconnection; layers; penetrating; terminals; flexible substrate; layer formed; interconnection layer; semiconductor layer; semiconductor device; semiconductor devices; conductive layer; penetrating terminals; individual devices; interconnection layers; /438/136/

Citation Formats

Grimmer, Derrick P, Paulson, Kenneth R, and Gilbert, James R. Method for fabricating an interconnected array of semiconductor devices. United States: N. p., 1989. Web.
Grimmer, Derrick P, Paulson, Kenneth R, & Gilbert, James R. Method for fabricating an interconnected array of semiconductor devices. United States.
Grimmer, Derrick P, Paulson, Kenneth R, and Gilbert, James R. Tue . "Method for fabricating an interconnected array of semiconductor devices". United States. https://www.osti.gov/servlets/purl/867127.
@article{osti_867127,
title = {Method for fabricating an interconnected array of semiconductor devices},
author = {Grimmer, Derrick P and Paulson, Kenneth R and Gilbert, James R},
abstractNote = {Semiconductor layer and conductive layer formed on a flexible substrate, divided into individual devices and interconnected with one another in series by interconnection layers and penetrating terminals.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1989},
month = {10}
}