skip to main content
DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Method and device for stand-off laser drilling and cutting

Abstract

A device for perforating material and a method of stand-off drilling using a laser. In its basic form a free-running laser beam creates a melt on the target and then a Q-switched short duration pulse is used to remove the material through the creation of a laser detonation wave. The advantage is a drilling/cutting method capable of working a target at lengthy stand-off distance. The device may employ 2 lasers or a single one operated in a free-running/Q-switched dual mode.

Inventors:
 [1];  [2];  [2]
  1. (Rte. 11, Box 1022, Fredericksburg, VA 22405)
  2. (214 Bonner Hall, SUNY-Buffalo, Buffalo, NY 14260)
Issue Date:
OSTI Identifier:
867116
Patent Number(s):
4870244
Application Number:
07/254,629
Assignee:
Copley, John A. (Rte. 11, Box 1022, Fredericksburg, VA 22405);Kwok, Hoi S. (214 Bonner Hall, SUNY-Buffalo, Buffalo, NY 14260);Domankevitz, Yacov (214 Bonner Hall, SUNY-Buffalo, Buffalo, NY 14260) OSTI
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
method; device; stand-off; laser; drilling; cutting; perforating; material; basic; form; free-running; beam; creates; melt; target; q-switched; duration; pulse; remove; creation; detonation; wave; advantage; capable; lengthy; distance; employ; lasers; single; operated; dual; mode; detonation wave; method capable; laser beam; laser drilling; basic form; cutting method; /219/

Citation Formats

Copley, John A., Kwok, Hoi S., and Domankevitz, Yacov. Method and device for stand-off laser drilling and cutting. United States: N. p., 1989. Web.
Copley, John A., Kwok, Hoi S., & Domankevitz, Yacov. Method and device for stand-off laser drilling and cutting. United States.
Copley, John A., Kwok, Hoi S., and Domankevitz, Yacov. Tue . "Method and device for stand-off laser drilling and cutting". United States. https://www.osti.gov/servlets/purl/867116.
@article{osti_867116,
title = {Method and device for stand-off laser drilling and cutting},
author = {Copley, John A. and Kwok, Hoi S. and Domankevitz, Yacov},
abstractNote = {A device for perforating material and a method of stand-off drilling using a laser. In its basic form a free-running laser beam creates a melt on the target and then a Q-switched short duration pulse is used to remove the material through the creation of a laser detonation wave. The advantage is a drilling/cutting method capable of working a target at lengthy stand-off distance. The device may employ 2 lasers or a single one operated in a free-running/Q-switched dual mode.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1989},
month = {9}
}

Patent:

Save / Share: