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Title: Electrical contacts for a thin-film semiconductor device

Abstract

A method of fabricating spaced-apart back contacts on a thin film of semiconductor material by forming strips of buffer material on top of the semiconductor material in locations corresponding to the desired dividing lines between back contacts, forming a film of metal substantially covering the semiconductor material and buffer strips, and scribing portions of the metal film overlying the buffer strips with a laser without contacting the underlying semiconductor material to separate the metal layer into a plurality of back contacts. The buffer material serves to protect the underlying semiconductor material from being damaged during the laser scribing. Back contacts and multi-cell photovoltaic modules incorporating such back contacts also are disclosed.

Inventors:
 [1];  [2];  [3]
  1. Yardley, PA
  2. Pennington, NJ
  3. East Brunswick, NJ
Issue Date:
OSTI Identifier:
867065
Patent Number(s):
4854974
Application Number:
07/197,433
Assignee:
Solarex Corporation (Rockville, MD)
Patent Classifications (CPCs):
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE Y02E - REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
DOE Contract Number:  
ZB4030563
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
electrical; contacts; thin-film; semiconductor; device; method; fabricating; spaced-apart; film; material; forming; strips; buffer; top; locations; corresponding; desired; dividing; lines; metal; substantially; covering; scribing; portions; overlying; laser; contacting; underlying; separate; layer; plurality; serves; protect; damaged; multi-cell; photovoltaic; modules; incorporating; disclosed; underlying semiconductor; buffer material; metal film; photovoltaic modules; electrical contacts; photovoltaic module; metal layer; electrical contact; semiconductor material; semiconductor device; substantially cover; laser scribing; substantially covering; thin-film semiconductor; film semiconductor; cell photovoltaic; material serves; forming strips; fabricating spaced-apart; locations corresponding; /136/257/

Citation Formats

Carlson, David E, Dickson, Charles R, and D'Aiello, Robert V. Electrical contacts for a thin-film semiconductor device. United States: N. p., 1989. Web.
Carlson, David E, Dickson, Charles R, & D'Aiello, Robert V. Electrical contacts for a thin-film semiconductor device. United States.
Carlson, David E, Dickson, Charles R, and D'Aiello, Robert V. Tue . "Electrical contacts for a thin-film semiconductor device". United States. https://www.osti.gov/servlets/purl/867065.
@article{osti_867065,
title = {Electrical contacts for a thin-film semiconductor device},
author = {Carlson, David E and Dickson, Charles R and D'Aiello, Robert V},
abstractNote = {A method of fabricating spaced-apart back contacts on a thin film of semiconductor material by forming strips of buffer material on top of the semiconductor material in locations corresponding to the desired dividing lines between back contacts, forming a film of metal substantially covering the semiconductor material and buffer strips, and scribing portions of the metal film overlying the buffer strips with a laser without contacting the underlying semiconductor material to separate the metal layer into a plurality of back contacts. The buffer material serves to protect the underlying semiconductor material from being damaged during the laser scribing. Back contacts and multi-cell photovoltaic modules incorporating such back contacts also are disclosed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1989},
month = {8}
}