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Title: Process for obtaining multiple sheet resistances for thin film hybrid microcircuit resistors

Abstract

A standard thin film circuit containing Ta.sub.2 N (100 ohms/square) resirs is fabricated by depositing on a dielectric substrate successive layers of Ta.sub.2 N, Ti and Pd, with a gold layer to provide conductors. The addition of a few simple photoprocessing steps to the standeard TFN manufacturing process enables the formation of Ta.sub.2 N+Ti (10 ohms/square) and Ta.sub.2 N+Ti+Pd (1 ohm/square) resistors in the same otherwise standard thin film circuit structure.

Inventors:
 [1]
  1. (Albuquerque, NM)
Issue Date:
Research Org.:
AT & T CORP
OSTI Identifier:
866838
Patent Number(s):
4801469
Assignee:
United States of America as represented by Department of Energy (Washington, DC) SNL
DOE Contract Number:  
AC04-76DP00789
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
process; obtaining; multiple; sheet; resistances; film; hybrid; microcircuit; resistors; standard; circuit; containing; 100; ohms; square; resirs; fabricated; depositing; dielectric; substrate; successive; layers; pd; gold; layer; provide; conductors; addition; simple; photoprocessing; steps; standeard; tfn; manufacturing; enables; formation; 10; ohm; otherwise; structure; manufacturing process; processing steps; successive layers; process enables; successive layer; processing step; hybrid microcircuit; circuit structure; multiple sheet; film circuit; film hybrid; dielectric substrate; /427/29/338/

Citation Formats

Norwood, David P. Process for obtaining multiple sheet resistances for thin film hybrid microcircuit resistors. United States: N. p., 1989. Web.
Norwood, David P. Process for obtaining multiple sheet resistances for thin film hybrid microcircuit resistors. United States.
Norwood, David P. Sun . "Process for obtaining multiple sheet resistances for thin film hybrid microcircuit resistors". United States. https://www.osti.gov/servlets/purl/866838.
@article{osti_866838,
title = {Process for obtaining multiple sheet resistances for thin film hybrid microcircuit resistors},
author = {Norwood, David P.},
abstractNote = {A standard thin film circuit containing Ta.sub.2 N (100 ohms/square) resirs is fabricated by depositing on a dielectric substrate successive layers of Ta.sub.2 N, Ti and Pd, with a gold layer to provide conductors. The addition of a few simple photoprocessing steps to the standeard TFN manufacturing process enables the formation of Ta.sub.2 N+Ti (10 ohms/square) and Ta.sub.2 N+Ti+Pd (1 ohm/square) resistors in the same otherwise standard thin film circuit structure.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1989},
month = {1}
}

Patent:

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