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Title: Wafer handling and placement tool

Abstract

A spring arm tool is provided for clamp engaging and supporting wafers while the tool is hand held. The tool includes a pair of relatively swingable jaw element supporting support arms and the jaw elements are notched to enjoy multiple point contact with a wafer peripheral portion. Also, one disclosed form of the tool includes remotely operable workpiece ejecting structure carried by the jaw elements thereof.

Inventors:
 [1]
  1. (22 Cottonwood La., Los Lunas, NM 87031)
Issue Date:
OSTI Identifier:
866462
Patent Number(s):
4717190
Application Number:
06/925,241
Assignee:
Witherspoon, Linda L. (22 Cottonwood La., Los Lunas, NM 87031) OSTI
DOE Contract Number:  
26-1631
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
wafer; handling; placement; tool; spring; arm; provided; clamp; engaging; supporting; wafers; hand; held; pair; relatively; swingable; jaw; element; support; arms; elements; notched; enjoy; multiple; contact; peripheral; portion; disclosed; form; remotely; operable; workpiece; ejecting; structure; carried; remotely operable; hand held; peripheral portion; closed form; jaw elements; support arm; /294/414/

Citation Formats

Witherspoon, Linda L. Wafer handling and placement tool. United States: N. p., 1988. Web.
Witherspoon, Linda L. Wafer handling and placement tool. United States.
Witherspoon, Linda L. Tue . "Wafer handling and placement tool". United States. https://www.osti.gov/servlets/purl/866462.
@article{osti_866462,
title = {Wafer handling and placement tool},
author = {Witherspoon, Linda L.},
abstractNote = {A spring arm tool is provided for clamp engaging and supporting wafers while the tool is hand held. The tool includes a pair of relatively swingable jaw element supporting support arms and the jaw elements are notched to enjoy multiple point contact with a wafer peripheral portion. Also, one disclosed form of the tool includes remotely operable workpiece ejecting structure carried by the jaw elements thereof.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1988},
month = {1}
}

Patent:

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