Wafer handling and placement tool

Witherspoon, Linda L

Title: Wafer handling and placement tool

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Abstract

A spring arm tool is provided for clamp engaging and supporting wafers while the tool is hand held. The tool includes a pair of relatively swingable jaw element supporting support arms and the jaw elements are notched to enjoy multiple point contact with a wafer peripheral portion. Also, one disclosed form of the tool includes remotely operable workpiece ejecting structure carried by the jaw elements thereof.

Inventors:

Witherspoon, Linda L ^[1]

22 Cottonwood La., Los Lunas, NM 87031

Issue Date:: 1988-01-05

OSTI Identifier:: 866462

Patent Number(s):: 4717190

Application Number:: 06/925,241

Assignee:: Witherspoon, Linda L. (22 Cottonwood La., Los Lunas, NM 87031)

Patent Classifications (CPCs):: Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10S - TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

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Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10S - TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10S294/902 - Gripping element

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L21/68707 - {the wafers being placed on a robot blade, or gripped by a gripper for conveyance}

B - PERFORMING OPERATIONS B25 - HAND TOOLS B25B - TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
B25B9/02 - without sliding or pivotal connections, e.g. tweezers, onepiece tongs

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10S - TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10S414/141 - includes means for gripping wafer

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DOE Contract Number:: 26-1631

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: wafer; handling; placement; tool; spring; arm; provided; clamp; engaging; supporting; wafers; hand; held; pair; relatively; swingable; jaw; element; support; arms; elements; notched; enjoy; multiple; contact; peripheral; portion; disclosed; form; remotely; operable; workpiece; ejecting; structure; carried; remotely operable; hand held; peripheral portion; closed form; jaw elements; support arm; /294/414/

Citation Formats


                    Witherspoon, Linda L. Wafer handling and placement tool.  United States: N. p., 1988. 
        Web.

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                    Witherspoon, Linda L. Wafer handling and placement tool.  United States.

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                    Witherspoon, Linda L. Tue .  
        "Wafer handling and placement tool".  United States.  https://www.osti.gov/servlets/purl/866462.

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@article{osti_866462,

  title        = {Wafer handling and placement tool},

  author       = {Witherspoon, Linda L},

  abstractNote = {A spring arm tool is provided for clamp engaging and supporting wafers while the tool is hand held. The tool includes a pair of relatively swingable jaw element supporting support arms and the jaw elements are notched to enjoy multiple point contact with a wafer peripheral portion. Also, one disclosed form of the tool includes remotely operable workpiece ejecting structure carried by the jaw elements thereof.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {1988},

  month        = {1}

}

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