Electrically conductive resinous bond and method of manufacture
Abstract
A method of bonding elements together with a bond of high strength and good electrical conductivity which comprises: applying an unfilled polyimide resin between surfaces of the elements to be bonded, heat treating said unfilled polyimide resin in stages between a temperature range of about 40.degree. to 365.degree. C. to form a strong adhesive bond between said elements, applying a metal-filled polyimide resin overcoat between said elements so as to provide electrical connection therebetween, and heat treating said metal-filled polyimide resin with substantially the same temperature profile as the unfilled polyimide resin. The present invention is also concerned with an adhesive, resilient, substantially void free bonding combination for providing a high strength, electrically conductive adhesive attachment between electrically conductive elements which comprises a major amount of an unfilled polyimide resin and a minor amount of a metal-filled polyimide resin.
- Inventors:
-
- (P.O. Box 4231, Clearwater, FL 33518)
- 865 N. Village Dr., Apt. 101B, St. Petersburg, FL 33702
- Issue Date:
- Research Org.:
- General Electric Co., Boston, MA (United States)
- OSTI Identifier:
- 866253
- Patent Number(s):
- 4666547
- Assignee:
- Snowden, Jr.; Thomas M. (P.O. Box 4231, Clearwater, FL 33518); Wells; Barbara J. (865 N. Village Dr., Apt. 101B, St. Petersburg, FL 33702)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C09 - DYES C09J - ADHESIVES
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01B - CABLES
- DOE Contract Number:
- AC04-76DP00656
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- electrically; conductive; resinous; bond; method; manufacture; bonding; elements; strength; electrical; conductivity; comprises; applying; unfilled; polyimide; resin; surfaces; bonded; heat; treating; stages; temperature; range; 40; degree; 365; form; strong; adhesive; metal-filled; overcoat; provide; connection; therebetween; substantially; profile; concerned; resilient; void; free; combination; providing; attachment; major; amount; minor; provide electrical; major amount; temperature profile; temperature range; electrically conductive; electrical conductivity; electrical connection; minor amount; heat treating; polyimide resin; void free; substantially void; conductive elements; conductive adhesive; adhesive bond; provide electric; /156/29/310/428/
Citation Formats
Snowden, Jr., Thomas M., and Wells, Barbara J. Electrically conductive resinous bond and method of manufacture. United States: N. p., 1987.
Web.
Snowden, Jr., Thomas M., & Wells, Barbara J. Electrically conductive resinous bond and method of manufacture. United States.
Snowden, Jr., Thomas M., and Wells, Barbara J. Thu .
"Electrically conductive resinous bond and method of manufacture". United States. https://www.osti.gov/servlets/purl/866253.
@article{osti_866253,
title = {Electrically conductive resinous bond and method of manufacture},
author = {Snowden, Jr., Thomas M. and Wells, Barbara J},
abstractNote = {A method of bonding elements together with a bond of high strength and good electrical conductivity which comprises: applying an unfilled polyimide resin between surfaces of the elements to be bonded, heat treating said unfilled polyimide resin in stages between a temperature range of about 40.degree. to 365.degree. C. to form a strong adhesive bond between said elements, applying a metal-filled polyimide resin overcoat between said elements so as to provide electrical connection therebetween, and heat treating said metal-filled polyimide resin with substantially the same temperature profile as the unfilled polyimide resin. The present invention is also concerned with an adhesive, resilient, substantially void free bonding combination for providing a high strength, electrically conductive adhesive attachment between electrically conductive elements which comprises a major amount of an unfilled polyimide resin and a minor amount of a metal-filled polyimide resin.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1987},
month = {1}
}