Inorganic-polymer-derived dielectric films
Abstract
A method of coating a substrate with a thin film of a polymer of predetermined porosity comprises depositing the thin film on the substrate from a non-gelled solution comprising at least one hydrolyzable metal alkoxide of a polymeric network forming cation, water, an alcohol compatible with the hydrolysis and the polymerization of the metal alkoxide, and an acid or a base, prior to depositing the film, controlling the structure of the polymer for a given composition of the solution exclusive of the acid or base component and the water component, (a) by adjusting each of the water content, the pH, and the temperature to obtain the desired concentration of alkoxide, and then adjusting the time of standing of the solution prior to lowering the temperature of the solution, and (b) lowering the temperature of the solution after the time of standing to about 15 degrees C. or lower to trap the solution in a state in which, after the depositing step, a coating of the desired porosity will be obtained, and curing the deposited film at a temperature effective for curing whereby there is obtained a thin film of a polymer of a predetermined porosity and corresponding pore size onmore »
- Inventors:
-
- Albuquerque, NM
- State College, PA
- Issue Date:
- Research Org.:
- AT&T
- OSTI Identifier:
- 866192
- Patent Number(s):
- 4652467
- Assignee:
- United States of America as represented by United States (Washington, DC)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B05 - SPRAYING OR ATOMISING IN GENERAL B05D - PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
C - CHEMISTRY C08 - ORGANIC MACROMOLECULAR COMPOUNDS C08G - MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- DOE Contract Number:
- AC04-76DP00789
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- inorganic-polymer-derived; dielectric; films; method; coating; substrate; film; polymer; predetermined; porosity; comprises; depositing; non-gelled; solution; comprising; hydrolyzable; metal; alkoxide; polymeric; network; forming; cation; water; alcohol; compatible; hydrolysis; polymerization; acid; base; prior; controlling; structure; composition; exclusive; component; adjusting; content; ph; temperature; obtain; desired; concentration; time; standing; lowering; 15; degrees; trap; step; obtained; curing; deposited; effective; whereby; corresponding; pore; size; metal alkoxide; temperature effective; pore size; solution comprising; comprises depositing; water content; polymeric network; deposited film; dielectric films; /427/438/
Citation Formats
Brinker, C Jeffrey, Keefer, Keith D, and Lenahan, Patrick M. Inorganic-polymer-derived dielectric films. United States: N. p., 1987.
Web.
Brinker, C Jeffrey, Keefer, Keith D, & Lenahan, Patrick M. Inorganic-polymer-derived dielectric films. United States.
Brinker, C Jeffrey, Keefer, Keith D, and Lenahan, Patrick M. Thu .
"Inorganic-polymer-derived dielectric films". United States. https://www.osti.gov/servlets/purl/866192.
@article{osti_866192,
title = {Inorganic-polymer-derived dielectric films},
author = {Brinker, C Jeffrey and Keefer, Keith D and Lenahan, Patrick M},
abstractNote = {A method of coating a substrate with a thin film of a polymer of predetermined porosity comprises depositing the thin film on the substrate from a non-gelled solution comprising at least one hydrolyzable metal alkoxide of a polymeric network forming cation, water, an alcohol compatible with the hydrolysis and the polymerization of the metal alkoxide, and an acid or a base, prior to depositing the film, controlling the structure of the polymer for a given composition of the solution exclusive of the acid or base component and the water component, (a) by adjusting each of the water content, the pH, and the temperature to obtain the desired concentration of alkoxide, and then adjusting the time of standing of the solution prior to lowering the temperature of the solution, and (b) lowering the temperature of the solution after the time of standing to about 15 degrees C. or lower to trap the solution in a state in which, after the depositing step, a coating of the desired porosity will be obtained, and curing the deposited film at a temperature effective for curing whereby there is obtained a thin film of a polymer of a predetermined porosity and corresponding pore size on the substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Thu Jan 01 00:00:00 EST 1987},
month = {Thu Jan 01 00:00:00 EST 1987}
}