Delayed cure bismaleimide resins

Title: Delayed cure bismaleimide resins

Full Record
Other Related Research

Abstract

Polybismaleimides prepared by delayed curing of bis-imides having the formula ##STR1## wherein R.sub.1 and R.sub.2 each independently is H, C.sub.1-4 -alkyl, C.sub.1-4 -alkoxy, Cl or Br, or R.sub.1 and R.sub.2 together form a fused 6-membered hydrocarbon aromatic ring, with the proviso that R.sub.1 and R.sub.2 are not t-butyl or t-butoxy; X is O, S or Se; n is 1-3; and the --(CH.sub.2).sub.n -- group, optionally, is substituted by 1-3 methyl groups or by fluorine.

Inventors:

Adams, Johnnie E ^[1]; Jamieson, Donald R ^[2]

Grandview, MO
Merriam, KS

Issue Date:: 1984-08-07

Research Org.:: Kansas City Plant (KCP), Kansas City, MO (United States)

OSTI Identifier:: 865123

Patent Number(s):: 4464520

Application Number:: 06/407,664

Assignee:: United States of America as represented by United States (Washington, DC)

Patent Classifications (CPCs):: C - CHEMISTRY C08 - ORGANIC MACROMOLECULAR COMPOUNDS C08G - MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS

C - CHEMISTRY C08 - ORGANIC MACROMOLECULAR COMPOUNDS C08F - MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS

Show more

C - CHEMISTRY C08 - ORGANIC MACROMOLECULAR COMPOUNDS C08G - MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
C08G73/124 - {the unsaturated precursors containing oxygen in the form of ether bonds in the main chain}
C08G73/123 - {the unsaturated precursors comprising halogen-containing substituents}

C - CHEMISTRY C08 - ORGANIC MACROMOLECULAR COMPOUNDS C08F - MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
C08F22/40 - Imides, e.g. cyclic imides

C - CHEMISTRY C08 - ORGANIC MACROMOLECULAR COMPOUNDS C08G - MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
C08G73/125 - {the unsaturated precursors containing atoms other than carbon, hydrogen, oxygen or nitrogen in the main chain}

Show less

DOE Contract Number:: AC04-76DP00613

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: delayed; cure; bismaleimide; resins; polybismaleimides; prepared; curing; bis-imides; formula; str1; independently; 1-4; -alkyl; -alkoxy; br; form; fused; 6-membered; hydrocarbon; aromatic; proviso; t-butyl; t-butoxy; 1-3; optionally; substituted; methyl; fluorine; hydrocarbon aromatic; /526/524/

Citation Formats


                    Adams, Johnnie E, and Jamieson, Donald R. Delayed cure bismaleimide resins.  United States: N. p., 1984. 
        Web.

Copy to clipboard


                    Adams, Johnnie E, & Jamieson, Donald R. Delayed cure bismaleimide resins.  United States.

Copy to clipboard


                    Adams, Johnnie E, and Jamieson, Donald R. Tue .  
        "Delayed cure bismaleimide resins".  United States.  https://www.osti.gov/servlets/purl/865123.

Copy to clipboard


                    
@article{osti_865123,

  title        = {Delayed cure bismaleimide resins},

  author       = {Adams, Johnnie E and Jamieson, Donald R},

  abstractNote = {Polybismaleimides prepared by delayed curing of bis-imides having the formula ##STR1## wherein R.sub.1 and R.sub.2 each independently is H, C.sub.1-4 -alkyl, C.sub.1-4 -alkoxy, Cl or Br, or R.sub.1 and R.sub.2 together form a fused 6-membered hydrocarbon aromatic ring, with the proviso that R.sub.1 and R.sub.2 are not t-butyl or t-butoxy; X is O, S or Se; n is 1-3; and the --(CH.sub.2).sub.n -- group, optionally, is substituted by 1-3 methyl groups or by fluorine.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {1984},

  month        = {8}

}

Copy to clipboard

Patent:

View Patent

Save / Share:

Export Metadata

Save to My Library

Similar Records in DOE Patents and OSTI.GOV collections:

Delayed cure bismaleimide resins

Patent

Prior art polybismaleimides begin to polymerize at or just above the melting point of the monomer. This patent describes new bismaleimide resins which have an increased pot life and provide longer time periods in which the monomer remains fluid. The resins can be polymerized into molded articles with a high uniformity of properties. (DLC)
Epoxy foams using multiple resins and curing agents

Patent Russick, Edward M [Rio Rancho, NM]; Rand, Peter B [Albuquerque, NM]

An epoxy foam comprising a plurality of resins, a plurality of curing agents, at least one blowing agent, at least one surfactant and optionally at least one filler and the process for making. Preferred is an epoxy foam comprising two resins of different reactivities, two curing agents, a blowing agent, a surfactant, and a filler. According to the present invention, an epoxy foam is prepared with tailorable reactivity, exotherm, and pore size by a process of admixing a plurality of resins with a plurality of curing agents, a surfactant and blowing agent, whereby a foamable mixture is formed and heatingmore »« less
Full Text Available
High energy electron beam curing of epoxy resin systems incorporating cationic photoinitiators

Patent Janke, Christopher J [Powell, TN]; Lopata, Vincent J [Manitoba, CA]; Havens, Stephen J [Knoxville, TN]; ...

A mixture of epoxy resins such as a semi-solid triglycidyl ether of tris (hydroxyphenyl) methane and a low viscosity bisphenol A glycidyl ether and a cationic photoinitiator such as a diaryliodonium salt is cured by irradiating with a dosage of electron beams from about 50 to about 150 kGy, forming a cross-linked epoxy resin polymer.
Full Text Available
Use of 2,5-dimethyl-2,5-hexane diamine as a curing agent for epoxy resins

Patent Rinde, James A. [Livermore, CA]; Newey, Herbert A. [Lafayette, CA]

Primary diamines of the formula ##STR1## wherein R is a straight chain saturated hydrocarbon of 2 to 4 carbons, a disubstituted benzene ring, or disubstituted dibenzo methane for use as a curing agent for epoxy resins. These curing agents can be used to form epoxy resin mixtures useful in filament winding and pre-impregnated fiber molding and in formulating film adhesives, powder coatings and molding powders. The epoxy mixtures form for such uses as room temperature non-reacting, intermediate stable state which has a latent cross-linking capability.
Full Text Available
High performance, rapid thermal/UV curing epoxy resin for additive manufacturing of short and continuous carbon fiber epoxy composites

Patent Lewicki, James

An additive manufacturing resin system including an additive manufacturing print head; a continuous carbon fiber or short carbon fibers operatively connected to the additive manufacturing print head; and a tailored resin operatively connected to the print head, wherein the tailored resin has a resin mass and wherein the tailored resin includes an epoxy component, a filler component, a catalyst component, and a chain extender component; wherein the epoxy component is 70-95% of the resin mass, wherein the filler component is 1-20% of the resin mass, wherein the catalyst component is 0.1-10% of the resin mass, and wherein the chain extendermore » component is 0-50% of the resin mass.« less
Full Text Available

Similar Records