Multi-lead heat sink
Abstract
The disclosure relates to a heat sink used to protect integrated circuits from the heat resulting from soldering them to circuit boards. A tubular housing contains a slidable member which engages somewhat inwardly extending connecting rods, each of which is rotatably attached at one end to the bottom of the housing. The other end of each rod is fastened to an expandable coil spring loop. As the member is pushed downward in the housing, its bottom edge engages and forces outward the connecting rods, thereby expanding the spring so that it will fit over an integrated circuit. After the device is in place, the member is slid upward and the spring contracts about the leads of the integrated circuit. Soldering is now conducted and the spring absorbs excess heat therefrom to protect the integrated circuit. The placement steps are repeated in reverse order to remove the heat sink for use again.
- Inventors:
-
- Albuquerque, NM
- Issue Date:
- Research Org.:
- Los Alamos National Laboratory (LANL), Los Alamos, NM (United States)
- OSTI Identifier:
- 865068
- Patent Number(s):
- 4457360
- Assignee:
- Regents of University of California (Berkeley, CA)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- DOE Contract Number:
- W-7405-ENG-36
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- multi-lead; heat; sink; disclosure; relates; protect; integrated; circuits; resulting; soldering; circuit; boards; tubular; housing; contains; slidable; engages; somewhat; inwardly; extending; connecting; rods; rotatably; attached; bottom; rod; fastened; expandable; coil; spring; loop; pushed; downward; edge; forces; outward; expanding; fit; device; slid; upward; contracts; leads; conducted; absorbs; excess; therefrom; placement; steps; repeated; reverse; remove; inwardly extending; connecting rod; connecting rods; tubular housing; circuit board; heat sink; disclosure relates; integrated circuits; integrated circuit; heat resulting; excess heat; circuit boards; coil spring; rotatably attached; housing contains; /165/24/228/269/
Citation Formats
Roose, Lars D. Multi-lead heat sink. United States: N. p., 1984.
Web.
Roose, Lars D. Multi-lead heat sink. United States.
Roose, Lars D. Sun .
"Multi-lead heat sink". United States. https://www.osti.gov/servlets/purl/865068.
@article{osti_865068,
title = {Multi-lead heat sink},
author = {Roose, Lars D},
abstractNote = {The disclosure relates to a heat sink used to protect integrated circuits from the heat resulting from soldering them to circuit boards. A tubular housing contains a slidable member which engages somewhat inwardly extending connecting rods, each of which is rotatably attached at one end to the bottom of the housing. The other end of each rod is fastened to an expandable coil spring loop. As the member is pushed downward in the housing, its bottom edge engages and forces outward the connecting rods, thereby expanding the spring so that it will fit over an integrated circuit. After the device is in place, the member is slid upward and the spring contracts about the leads of the integrated circuit. Soldering is now conducted and the spring absorbs excess heat therefrom to protect the integrated circuit. The placement steps are repeated in reverse order to remove the heat sink for use again.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1984},
month = {1}
}