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Title: Multiwire conductor having increased interwire resistance and good mechanical stability and method for making same

An improved multiwire conductor of the type which is mechanically stabilized by a solder filler. A solder filled conductor is heated to a temperature sufficient to make the solder brittle, but below the melting point of the solder. While still hot, the conductor is flexed, causing the solder to separate from the wires comprising the conductor, thereby increasing the interwire resistance. In one embodiment the conductor may be heated to a temperature above the eutectic temperature of the solder so that a controlled amount of solder is removed. The subject invention is particularly suited for use with braided, ribbon-type, solder filled superconductors.
 [1];  [2]
  1. (Seattle, WA)
  2. (East Patchogue, NY)
Issue Date:
OSTI Identifier:
United States of America as represented by United States (Washington, DC) BNL
Patent Number(s):
US 4431862
Application Number:
Contract Number:
Research Org:
Country of Publication:
United States
multiwire; conductor; increased; interwire; resistance; mechanical; stability; method; improved; type; mechanically; stabilized; solder; filler; filled; heated; temperature; sufficient; brittle; below; melting; hot; flexed; causing; separate; wires; comprising; increasing; embodiment; eutectic; controlled; amount; removed; subject; particularly; suited; braided; ribbon-type; superconductors; particularly suited; temperature sufficient; mechanical stability; controlled amount; solder filled; multiwire conductor; eutectic temperature; interwire resistance; mechanically stabilized; solder filler; improved multiwire; increased interwire; filled conductor; /174/29/156/228/335/428/505/