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Title: Multiwire conductor having greatly increased interwire resistance and method for making same

An improved multiwire conductor of the type which is mechanically stabilized by a tin based solder filler. A solder filled conductor is heated to a temperature above its melting point for a period long enough to allow a substantial amount of copper to be dissolved from the wires comprising the conductor. The copper forms the brittle intermetallic compound Cu.sub.5 Sn.sub.6 with tin in the solder. After cooling the conductor is flexed causing a random cracking of the solder, and thereby increasing the interwire resistance of the conductor. The subject invention is particularly adapted for use with braided, ribbon-type solder filled superconductors.
 [1];  [2]
  1. (Seattle, WA)
  2. (Bellport, NY)
Issue Date:
OSTI Identifier:
United States of America as represented by United States (Washington, DC) BNL
Patent Number(s):
US 4426550
Application Number:
Contract Number:
Research Org:
Country of Publication:
United States
multiwire; conductor; greatly; increased; interwire; resistance; method; improved; type; mechanically; stabilized; based; solder; filler; filled; heated; temperature; melting; period; allow; substantial; amount; copper; dissolved; wires; comprising; forms; brittle; intermetallic; compound; cu; cooling; flexed; causing; random; cracking; increasing; subject; particularly; adapted; braided; ribbon-type; superconductors; particularly adapted; intermetallic compound; substantial amount; greatly increased; brittle intermetallic; solder filled; multiwire conductor; interwire resistance; mechanically stabilized; solder filler; improved multiwire; greatly increase; increased interwire; filled conductor; metallic compound; /174/29/156/228/335/423/505/