Method of producing microporous joints in metal bodies
Abstract
Tungsten is placed in contact with either molybdenum, tantalum, niobium, vanadium, rhenium, or other metal of atoms having a different diffusion coefficient than tungsten. The metals are heated so that the atoms having the higher diffusion coefficient migrate to the metal having the lower diffusion rate, leaving voids in the higher diffusion coefficient metal. Heating is continued until the voids are interconnected.
- Inventors:
-
- Danville, CA
- Issue Date:
- OSTI Identifier:
- 864430
- Patent Number(s):
- 4362582
- Assignee:
- United States of America as represented by United States (Washington, DC)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C21 - METALLURGY OF IRON C21D - MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS
G - PHYSICS G21 - NUCLEAR PHYSICS G21D - NUCLEAR POWER PLANT
- DOE Contract Number:
- AT(04-3)-189
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- method; producing; microporous; joints; metal; bodies; tungsten; placed; contact; molybdenum; tantalum; niobium; vanadium; rhenium; atoms; diffusion; coefficient; metals; heated; migrate; rate; leaving; voids; heating; continued; interconnected; diffusion coefficient; producing microporous; metal bodies; /148/228/376/976/
Citation Formats
Danko, Joseph C. Method of producing microporous joints in metal bodies. United States: N. p., 1982.
Web.
Danko, Joseph C. Method of producing microporous joints in metal bodies. United States.
Danko, Joseph C. Fri .
"Method of producing microporous joints in metal bodies". United States. https://www.osti.gov/servlets/purl/864430.
@article{osti_864430,
title = {Method of producing microporous joints in metal bodies},
author = {Danko, Joseph C},
abstractNote = {Tungsten is placed in contact with either molybdenum, tantalum, niobium, vanadium, rhenium, or other metal of atoms having a different diffusion coefficient than tungsten. The metals are heated so that the atoms having the higher diffusion coefficient migrate to the metal having the lower diffusion rate, leaving voids in the higher diffusion coefficient metal. Heating is continued until the voids are interconnected.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1982},
month = {1}
}