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Title: Screenable contact structure and method for semiconductor devices

Abstract

An ink composition for deposition upon the surface of a semiconductor device to provide a contact area for connection to external circuitry is disclosed, the composition comprising an ink system containing a metal powder, a binder and vehicle, and a metal frit. The ink is screened onto the semiconductor surface in the desired pattern and is heated to a temperature sufficient to cause the metal frit to become liquid. The metal frit dissolves some of the metal powder and densifies the structure by transporting the dissolved metal powder in a liquid sintering process. The sintering process typically may be carried out in any type of atmosphere. A small amount of dopant or semiconductor material may be added to the ink systems to achieve particular results if desired.

Inventors:
 [1]
  1. (2154 Blackmore Ct., San Diego, CA 92109)
Issue Date:
OSTI Identifier:
863642
Patent Number(s):
4219448
Application Number:
05/913,872
Assignee:
Ross; Bernd (2154 Blackmore Ct., San Diego, CA 92109) OSTI
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
screenable; contact; structure; method; semiconductor; devices; composition; deposition; surface; device; provide; connection; external; circuitry; disclosed; comprising; containing; metal; powder; binder; vehicle; frit; screened; desired; pattern; heated; temperature; sufficient; liquid; dissolves; densifies; transporting; dissolved; sintering; process; typically; carried; type; atmosphere; amount; dopant; material; added; systems; achieve; particular; results; external circuit; composition comprising; semiconductor material; temperature sufficient; semiconductor device; semiconductor surface; semiconductor devices; metal powder; desired pattern; sintering process; external circuitry; dissolved metal; contact structure; process typically; /252/29/75/106/136/427/

Citation Formats

Ross, Bernd. Screenable contact structure and method for semiconductor devices. United States: N. p., 1980. Web.
Ross, Bernd. Screenable contact structure and method for semiconductor devices. United States.
Ross, Bernd. Tue . "Screenable contact structure and method for semiconductor devices". United States. https://www.osti.gov/servlets/purl/863642.
@article{osti_863642,
title = {Screenable contact structure and method for semiconductor devices},
author = {Ross, Bernd},
abstractNote = {An ink composition for deposition upon the surface of a semiconductor device to provide a contact area for connection to external circuitry is disclosed, the composition comprising an ink system containing a metal powder, a binder and vehicle, and a metal frit. The ink is screened onto the semiconductor surface in the desired pattern and is heated to a temperature sufficient to cause the metal frit to become liquid. The metal frit dissolves some of the metal powder and densifies the structure by transporting the dissolved metal powder in a liquid sintering process. The sintering process typically may be carried out in any type of atmosphere. A small amount of dopant or semiconductor material may be added to the ink systems to achieve particular results if desired.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1980},
month = {8}
}

Patent:

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