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Title: Method for joining metal by solid-state bonding

Abstract

The present development is directed to a method for joining metal at relatively low temperatures by solid-state bonding. Planar surfaces of the metal workpieces are placed in a parallel abutting relationship with one another. A load is applied to at least one of the workpieces for forcing the workpieces together while one of the workpieces is relatively slowly oscillated in a rotary motion over a distance of about 1.degree.. After a preselected number of oscillations, the rotary motion is terminated and the bond between the abutting surfaces is effected. An additional load may be applied to facilitate the bond after terminating the rotary motion.

Inventors:
 [1];  [2];  [3]
+ Show Inventor Affiliations
  1. Oak Ridge, TN
  2. Kingston, TN
  3. Knoxville, TN
Issue Date:
Research Org.:
Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
OSTI Identifier:
863402
Patent Number(s):
4163516
Assignee:
United States of America as represented by United States (Washington, DC)
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
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DOE Contract Number:  
W-7405-ENG-26
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
method; joining; metal; solid-state; bonding; directed; relatively; temperatures; planar; surfaces; workpieces; placed; parallel; abutting; relationship; load; applied; forcing; slowly; oscillated; rotary; motion; distance; degree; preselected; oscillations; terminated; bond; effected; additional; facilitate; terminating; planar surfaces; rotary motion; planar surface; relatively slow; abutting relationship; solid-state bonding; metal workpieces; metal workpiece; joining metal; abutting surface; /228/

Citation Formats

Burkhart, L Elkin, Fultz, Chester R, and Maulden, Kerry A. Method for joining metal by solid-state bonding. United States: N. p., 1979. Web.
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Burkhart, L Elkin, Fultz, Chester R, & Maulden, Kerry A. Method for joining metal by solid-state bonding. United States.
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Burkhart, L Elkin, Fultz, Chester R, and Maulden, Kerry A. Mon . "Method for joining metal by solid-state bonding". United States. https://www.osti.gov/servlets/purl/863402.
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@article{osti_863402,
title = {Method for joining metal by solid-state bonding},
author = {Burkhart, L Elkin and Fultz, Chester R and Maulden, Kerry A},
abstractNote = {The present development is directed to a method for joining metal at relatively low temperatures by solid-state bonding. Planar surfaces of the metal workpieces are placed in a parallel abutting relationship with one another. A load is applied to at least one of the workpieces for forcing the workpieces together while one of the workpieces is relatively slowly oscillated in a rotary motion over a distance of about 1.degree.. After a preselected number of oscillations, the rotary motion is terminated and the bond between the abutting surfaces is effected. An additional load may be applied to facilitate the bond after terminating the rotary motion.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1979},
month = {1}
}
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