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Title: Electroless plating apparatus for discrete microsized particles

Abstract

Method and apparatus are disclosed for producing very uniform coatings of a desired material on discrete microsized particles by electroless techniques. Agglomeration or bridging of the particles during the deposition process is prevented by imparting a sufficiently random motion to the particles that they are not in contact with each other for a time sufficient for such to occur.

Inventors:
 [1]
  1. Los Alamos, NM
Issue Date:
Research Org.:
Los Alamos National Lab. (LANL), Los Alamos, NM (United States)
OSTI Identifier:
863163
Patent Number(s):
4109612
Assignee:
United States of America as represented by United States (Washington, DC)
Patent Classifications (CPCs):
C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
electroless; plating; apparatus; discrete; microsized; particles; method; disclosed; producing; uniform; coatings; desired; material; techniques; agglomeration; bridging; deposition; process; prevented; imparting; sufficiently; random; motion; contact; time; sufficient; occur; electroless plating; desired material; uniform coating; sized particles; time sufficient; deposition process; sufficiently random; microsized particles; discrete microsized; uniform coatings; plating apparatus; /118/134/

Citation Formats

Mayer, Anton. Electroless plating apparatus for discrete microsized particles. United States: N. p., 1978. Web.
Mayer, Anton. Electroless plating apparatus for discrete microsized particles. United States.
Mayer, Anton. Sun . "Electroless plating apparatus for discrete microsized particles". United States. https://www.osti.gov/servlets/purl/863163.
@article{osti_863163,
title = {Electroless plating apparatus for discrete microsized particles},
author = {Mayer, Anton},
abstractNote = {Method and apparatus are disclosed for producing very uniform coatings of a desired material on discrete microsized particles by electroless techniques. Agglomeration or bridging of the particles during the deposition process is prevented by imparting a sufficiently random motion to the particles that they are not in contact with each other for a time sufficient for such to occur.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1978},
month = {1}
}

Patent:

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