Electroless plating apparatus for discrete microsized particles
Abstract
Method and apparatus are disclosed for producing very uniform coatings of a desired material on discrete microsized particles by electroless techniques. Agglomeration or bridging of the particles during the deposition process is prevented by imparting a sufficiently random motion to the particles that they are not in contact with each other for a time sufficient for such to occur.
- Inventors:
-
- Los Alamos, NM
- Issue Date:
- Research Org.:
- Los Alamos National Laboratory (LANL), Los Alamos, NM (United States)
- OSTI Identifier:
- 863163
- Patent Number(s):
- 4109612
- Assignee:
- United States of America as represented by United States (Washington, DC)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- electroless; plating; apparatus; discrete; microsized; particles; method; disclosed; producing; uniform; coatings; desired; material; techniques; agglomeration; bridging; deposition; process; prevented; imparting; sufficiently; random; motion; contact; time; sufficient; occur; electroless plating; desired material; uniform coating; sized particles; time sufficient; deposition process; sufficiently random; microsized particles; discrete microsized; uniform coatings; plating apparatus; /118/134/
Citation Formats
Mayer, Anton. Electroless plating apparatus for discrete microsized particles. United States: N. p., 1978.
Web.
Mayer, Anton. Electroless plating apparatus for discrete microsized particles. United States.
Mayer, Anton. Sun .
"Electroless plating apparatus for discrete microsized particles". United States. https://www.osti.gov/servlets/purl/863163.
@article{osti_863163,
title = {Electroless plating apparatus for discrete microsized particles},
author = {Mayer, Anton},
abstractNote = {Method and apparatus are disclosed for producing very uniform coatings of a desired material on discrete microsized particles by electroless techniques. Agglomeration or bridging of the particles during the deposition process is prevented by imparting a sufficiently random motion to the particles that they are not in contact with each other for a time sufficient for such to occur.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1978},
month = {1}
}
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