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Title: Electrolytic plating apparatus for discrete microsized particles

Abstract

Method and apparatus are disclosed for electrolytically producing very uniform coatings of a desired material on discrete microsized particles. Agglomeration or bridging of the particles during the deposition process is prevented by imparting a sufficiently random motion to the particles that they are not in contact with a powered cathode for a time sufficient for such to occur.

Inventors:
 [1]
  1. Los Alamos, NM
Issue Date:
Research Org.:
Los Alamos National Lab. (LANL), Los Alamos, NM (United States)
OSTI Identifier:
862718
Patent Number(s):
3994796
Application Number:
05/612,393
Assignee:
United States of America as represented by United States Energy (Washington, DC)
Patent Classifications (CPCs):
C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE Y02E - REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
DOE Contract Number:  
W-7405-ENG-36
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
electrolytic; plating; apparatus; discrete; microsized; particles; method; disclosed; electrolytically; producing; uniform; coatings; desired; material; agglomeration; bridging; deposition; process; prevented; imparting; sufficiently; random; motion; contact; powered; cathode; time; sufficient; occur; desired material; uniform coating; sized particles; time sufficient; deposition process; sufficiently random; microsized particles; discrete microsized; uniform coatings; electrolytic plating; electrolytically producing; plating apparatus; /204/

Citation Formats

Mayer, Anton. Electrolytic plating apparatus for discrete microsized particles. United States: N. p., 1976. Web.
Mayer, Anton. Electrolytic plating apparatus for discrete microsized particles. United States.
Mayer, Anton. Tue . "Electrolytic plating apparatus for discrete microsized particles". United States. https://www.osti.gov/servlets/purl/862718.
@article{osti_862718,
title = {Electrolytic plating apparatus for discrete microsized particles},
author = {Mayer, Anton},
abstractNote = {Method and apparatus are disclosed for electrolytically producing very uniform coatings of a desired material on discrete microsized particles. Agglomeration or bridging of the particles during the deposition process is prevented by imparting a sufficiently random motion to the particles that they are not in contact with a powered cathode for a time sufficient for such to occur.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1976},
month = {11}
}

Patent:

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