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Title: Diffusion bonding

Abstract

1. A method for joining beryllium to beryllium by diffusion bonding, comprising the steps of coating at least one surface portion of at least two beryllium pieces with nickel, positioning a coated surface portion in a contiguous relationship with an other surface portion, subjecting the contiguously disposed surface portions to an environment having an atmosphere at a pressure lower than ambient pressure, applying a force upon the beryllium pieces for causing the contiguous surface portions to abut against each other, heating the contiguous surface portions to a maximum temperature less than the melting temperature of the beryllium, substantially uniformly decreasing the applied force while increasing the temperature after attaining a temperature substantially above room temperature, and maintaining a portion of the applied force at a temperature corresponding to about maximum temperature for a duration sufficient to effect the diffusion bond between the contiguous surface portions.

Inventors:
 [1]
  1. Oak Ridge, TN
Issue Date:
Research Org.:
UNION CARBIDE CORP
OSTI Identifier:
862575
Patent Number(s):
3964667
Assignee:
United States of America as represented by United States Energy (Washington, DC)
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
DOE Contract Number:  
W-7405-ENG-26
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
diffusion; bonding; method; joining; beryllium; comprising; steps; coating; surface; portion; pieces; nickel; positioning; coated; contiguous; relationship; subjecting; contiguously; disposed; portions; environment; atmosphere; pressure; ambient; applying; force; causing; abut; heating; maximum; temperature; melting; substantially; uniformly; decreasing; applied; increasing; attaining; maintaining; corresponding; duration; sufficient; effect; bond; surface portions; temperature substantially; substantially uniformly; coated surface; surface portion; melting temperature; substantially uniform; maximum temperature; ambient pressure; fusion bonding; applied force; beryllium pieces; temperature corresponding; diffusion bonding; fusion bond; joining beryllium; /228/

Citation Formats

Anderson, Robert C. Diffusion bonding. United States: N. p., 1976. Web.
Anderson, Robert C. Diffusion bonding. United States.
Anderson, Robert C. Tue . "Diffusion bonding". United States. https://www.osti.gov/servlets/purl/862575.
@article{osti_862575,
title = {Diffusion bonding},
author = {Anderson, Robert C},
abstractNote = {1. A method for joining beryllium to beryllium by diffusion bonding, comprising the steps of coating at least one surface portion of at least two beryllium pieces with nickel, positioning a coated surface portion in a contiguous relationship with an other surface portion, subjecting the contiguously disposed surface portions to an environment having an atmosphere at a pressure lower than ambient pressure, applying a force upon the beryllium pieces for causing the contiguous surface portions to abut against each other, heating the contiguous surface portions to a maximum temperature less than the melting temperature of the beryllium, substantially uniformly decreasing the applied force while increasing the temperature after attaining a temperature substantially above room temperature, and maintaining a portion of the applied force at a temperature corresponding to about maximum temperature for a duration sufficient to effect the diffusion bond between the contiguous surface portions.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1976},
month = {6}
}

Patent:

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