Magnetron sputtering source
Abstract
A magnetron sputtering source for sputtering coating substrates includes a high thermal conductivity electrically insulating ceramic and magnetically attached sputter target which can eliminate vacuum sealing and direct fluid cooling of the cathode assembly. The magnetron sputtering source design results in greater compactness, improved operating characteristics, greater versatility, and low fabrication cost. The design easily retrofits most sputtering apparatuses and provides for safe, easy, and cost effective target replacement, installation, and removal. 12 figs.
- Inventors:
- Issue Date:
- OSTI Identifier:
- 7167745
- Patent Number(s):
- 5333726
- Application Number:
- PPN: US 8-005122
- Assignee:
- Univ. of California, Oakland, CA (United States)
- DOE Contract Number:
- W-7405-ENG-48
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 15 Jan 1993
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; CATHODE SPUTTERING; MATERIALS; PHYSICAL VAPOR DEPOSITION; DESIGN; ELECTRICAL INSULATORS; MAGNETRONS; TARGETS; DEPOSITION; ELECTRICAL EQUIPMENT; ELECTRON TUBES; ELECTRONIC EQUIPMENT; EQUIPMENT; MICROWAVE EQUIPMENT; MICROWAVE TUBES; SPUTTERING; SURFACE COATING; 360101* - Metals & Alloys- Preparation & Fabrication; 360201 - Ceramics, Cermets, & Refractories- Preparation & Fabrication; 360601 - Other Materials- Preparation & Manufacture
Citation Formats
Makowiecki, D M, McKernan, M A, Grabner, R F, and Ramsey, P B. Magnetron sputtering source. United States: N. p., 1994.
Web.
Makowiecki, D M, McKernan, M A, Grabner, R F, & Ramsey, P B. Magnetron sputtering source. United States.
Makowiecki, D M, McKernan, M A, Grabner, R F, and Ramsey, P B. Tue .
"Magnetron sputtering source". United States.
@article{osti_7167745,
title = {Magnetron sputtering source},
author = {Makowiecki, D M and McKernan, M A and Grabner, R F and Ramsey, P B},
abstractNote = {A magnetron sputtering source for sputtering coating substrates includes a high thermal conductivity electrically insulating ceramic and magnetically attached sputter target which can eliminate vacuum sealing and direct fluid cooling of the cathode assembly. The magnetron sputtering source design results in greater compactness, improved operating characteristics, greater versatility, and low fabrication cost. The design easily retrofits most sputtering apparatuses and provides for safe, easy, and cost effective target replacement, installation, and removal. 12 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1994},
month = {8}
}
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