skip to main content
DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Magnetron sputtering source

Abstract

A magnetron sputtering source for sputtering coating substrates includes a high thermal conductivity electrically insulating ceramic and magnetically attached sputter target which can eliminate vacuum sealing and direct fluid cooling of the cathode assembly. The magnetron sputtering source design results in greater compactness, improved operating characteristics, greater versatility, and low fabrication cost. The design easily retrofits most sputtering apparatuses and provides for safe, easy, and cost effective target replacement, installation, and removal. 12 figs.

Inventors:
; ; ;
Issue Date:
OSTI Identifier:
7167745
Patent Number(s):
5333726 A
Application Number:
PPN: US 8-005122
Assignee:
Univ. of California, Oakland, CA (United States)
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Resource Relation:
Patent File Date: 15 Jan 1993
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; CATHODE SPUTTERING; MATERIALS; PHYSICAL VAPOR DEPOSITION; DESIGN; ELECTRICAL INSULATORS; MAGNETRONS; TARGETS; DEPOSITION; ELECTRICAL EQUIPMENT; ELECTRON TUBES; ELECTRONIC EQUIPMENT; EQUIPMENT; MICROWAVE EQUIPMENT; MICROWAVE TUBES; SPUTTERING; SURFACE COATING; 360101* - Metals & Alloys- Preparation & Fabrication; 360201 - Ceramics, Cermets, & Refractories- Preparation & Fabrication; 360601 - Other Materials- Preparation & Manufacture

Citation Formats

Makowiecki, D M, McKernan, M A, Grabner, R F, and Ramsey, P B. Magnetron sputtering source. United States: N. p., 1994. Web.
Makowiecki, D M, McKernan, M A, Grabner, R F, & Ramsey, P B. Magnetron sputtering source. United States.
Makowiecki, D M, McKernan, M A, Grabner, R F, and Ramsey, P B. Tue . "Magnetron sputtering source". United States.
@article{osti_7167745,
title = {Magnetron sputtering source},
author = {Makowiecki, D M and McKernan, M A and Grabner, R F and Ramsey, P B},
abstractNote = {A magnetron sputtering source for sputtering coating substrates includes a high thermal conductivity electrically insulating ceramic and magnetically attached sputter target which can eliminate vacuum sealing and direct fluid cooling of the cathode assembly. The magnetron sputtering source design results in greater compactness, improved operating characteristics, greater versatility, and low fabrication cost. The design easily retrofits most sputtering apparatuses and provides for safe, easy, and cost effective target replacement, installation, and removal. 12 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1994},
month = {8}
}