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Title: Inert electrode connection

Abstract

An inert electrode connection is disclosed wherein a layer of inert electrode material is bonded to a layer of conductive material by providing at least one intermediate layer of material therebetween comprising a predetermined ratio of inert material to conductive material. In a preferred embodiment, the connection is formed by placing in a die a layer of powdered inert material, at least one layer of a mixture of powdered inert material and conductive material, and a layer of powdered conductive material. The connection is then formed by pressing the material at 15,000--20,000 psi to form a powder compact and then densifying the powder compact in an inert or reducing atmosphere at a temperature of 1,200--1,500 C. 5 figs.

Inventors:
; ; ;
Issue Date:
OSTI Identifier:
7146616
Patent Number(s):
4500406 A
Application Number:
PPN: US 6-560602
Assignee:
Aluminum Co. of America, Pittsburgh, PA (United States) PTO; EDB-94-125323
DOE Contract Number:  
FC07-80CS40158
Resource Type:
Patent
Resource Relation:
Patent File Date: 12 Dec 1983
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; ELECTRIC CONDUCTORS; BONDING; ELECTRODES; COMPACTING; CONTROLLED ATMOSPHERES; FABRICATION; POWDERS; ATMOSPHERES; JOINING; 426000* - Engineering- Components, Electron Devices & Circuits- (1990-)

Citation Formats

Weyand, J.D., Woods, R.W., DeYoung, D.H., and Ray, S.P. Inert electrode connection. United States: N. p., 1985. Web.
Weyand, J.D., Woods, R.W., DeYoung, D.H., & Ray, S.P. Inert electrode connection. United States.
Weyand, J.D., Woods, R.W., DeYoung, D.H., and Ray, S.P. Tue . "Inert electrode connection". United States.
@article{osti_7146616,
title = {Inert electrode connection},
author = {Weyand, J.D. and Woods, R.W. and DeYoung, D.H. and Ray, S.P.},
abstractNote = {An inert electrode connection is disclosed wherein a layer of inert electrode material is bonded to a layer of conductive material by providing at least one intermediate layer of material therebetween comprising a predetermined ratio of inert material to conductive material. In a preferred embodiment, the connection is formed by placing in a die a layer of powdered inert material, at least one layer of a mixture of powdered inert material and conductive material, and a layer of powdered conductive material. The connection is then formed by pressing the material at 15,000--20,000 psi to form a powder compact and then densifying the powder compact in an inert or reducing atmosphere at a temperature of 1,200--1,500 C. 5 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1985},
month = {2}
}