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Title: Soft x-ray reduction camera for submicron lithography

Abstract

Soft x-ray projection lithography can be performed using x-ray optical components and spherical imaging lenses (mirrors), which form an x-ray reduction camera. The x-ray reduction is capable of projecting a 5x demagnified image of a mask onto a resist coated wafer using 4.5 nm radiation. The diffraction limited resolution of this design is about 135 nm with a depth of field of about 2.8 microns and a field of view of 0.2 cm[sup 2]. X-ray reflecting masks (patterned x-ray multilayer mirrors) which are fabricated on thick substrates and can be made relatively distortion free are used, with a laser produced plasma for the source. Higher resolution and/or larger areas are possible by varying the optic figures of the components and source characteristics. 9 figures.

Inventors:
;
Issue Date:
OSTI Identifier:
7083865
Patent Number(s):
5003567
Application Number:
PPN: US 7-308332
Assignee:
PTO; EDB-94-111354
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Resource Relation:
Patent File Date: 9 Feb 1989
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; INTEGRATED CIRCUITS; MASKING; OPTICAL SYSTEMS; DESIGN; SOFT X RADIATION; ELECTROMAGNETIC RADIATION; ELECTRONIC CIRCUITS; IONIZING RADIATIONS; MICROELECTRONIC CIRCUITS; RADIATIONS; X RADIATION; 426000* - Engineering- Components, Electron Devices & Circuits- (1990-)

Citation Formats

Hawryluk, A M, and Seppala, L G. Soft x-ray reduction camera for submicron lithography. United States: N. p., 1991. Web.
Hawryluk, A M, & Seppala, L G. Soft x-ray reduction camera for submicron lithography. United States.
Hawryluk, A M, and Seppala, L G. Tue . "Soft x-ray reduction camera for submicron lithography". United States.
@article{osti_7083865,
title = {Soft x-ray reduction camera for submicron lithography},
author = {Hawryluk, A M and Seppala, L G},
abstractNote = {Soft x-ray projection lithography can be performed using x-ray optical components and spherical imaging lenses (mirrors), which form an x-ray reduction camera. The x-ray reduction is capable of projecting a 5x demagnified image of a mask onto a resist coated wafer using 4.5 nm radiation. The diffraction limited resolution of this design is about 135 nm with a depth of field of about 2.8 microns and a field of view of 0.2 cm[sup 2]. X-ray reflecting masks (patterned x-ray multilayer mirrors) which are fabricated on thick substrates and can be made relatively distortion free are used, with a laser produced plasma for the source. Higher resolution and/or larger areas are possible by varying the optic figures of the components and source characteristics. 9 figures.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1991},
month = {3}
}

Patent:
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