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Title: Shunt attachment and method for interfacing current collection systems

Abstract

A composite brush to shunt attachment wherein a volatile component of a composite but mostly metallic brush, used for current collection purposes, does not upon welding or brazing, adversely affect the formation of the interfacial bond with a conductive shunt which carries the current from the zone of the brush. The brush to shunt attachment for a brush material of copper-graphite composite and a shunt of copper, or substituting silver for copper as an alternative, is made through a hot isostatic pressing (HIP). The HIP process includes applying high pressure and temperature simultaneously at the brush to shunt interface, after it has been isolated or canned in a metal casing in which the air adjacent to the interface has been evacuated and the interfacial area has been sealed before the application of pressure and temperature. 6 figs.

Inventors:
; ;
Issue Date:
Research Org.:
Westinghouse Electric Corp., Pittsburgh, PA (United States)
OSTI Identifier:
7045239
Patent Number(s):
5168620
Application Number:
PPN: US 7-614796
Assignee:
Westinghouse Electric Corp., Pittsburgh, PA (United States)
DOE Contract Number:  
AC03-86SF16518
Resource Type:
Patent
Resource Relation:
Patent File Date: 15 Nov 1990
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; ELECTRICAL EQUIPMENT; DESIGN; CHARGE CARRIERS; COMPOSITE MATERIALS; ELECTRIC CONDUCTORS; FABRICATION; EQUIPMENT; MATERIALS; 426000* - Engineering- Components, Electron Devices & Circuits- (1990-)

Citation Formats

Denney, P E, Iyer, N C, and Hannan, III, W F. Shunt attachment and method for interfacing current collection systems. United States: N. p., 1992. Web.
Denney, P E, Iyer, N C, & Hannan, III, W F. Shunt attachment and method for interfacing current collection systems. United States.
Denney, P E, Iyer, N C, and Hannan, III, W F. Tue . "Shunt attachment and method for interfacing current collection systems". United States.
@article{osti_7045239,
title = {Shunt attachment and method for interfacing current collection systems},
author = {Denney, P E and Iyer, N C and Hannan, III, W F},
abstractNote = {A composite brush to shunt attachment wherein a volatile component of a composite but mostly metallic brush, used for current collection purposes, does not upon welding or brazing, adversely affect the formation of the interfacial bond with a conductive shunt which carries the current from the zone of the brush. The brush to shunt attachment for a brush material of copper-graphite composite and a shunt of copper, or substituting silver for copper as an alternative, is made through a hot isostatic pressing (HIP). The HIP process includes applying high pressure and temperature simultaneously at the brush to shunt interface, after it has been isolated or canned in a metal casing in which the air adjacent to the interface has been evacuated and the interfacial area has been sealed before the application of pressure and temperature. 6 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1992},
month = {12}
}

Patent:
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