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Title: Etching process for improving the strength of a laser-machined silicon-based ceramic article

Abstract

A process is disclosed for improving the strength of laser-machined articles formed of a silicon-based ceramic material such as silicon nitride, in which the laser-machined surface is immersed in an etching solution of hydrofluoric acid and nitric acid for a duration sufficient to remove substantially all of a silicon film residue on the surface but insufficient to allow the solution to unduly attack the grain boundaries of the underlying silicon nitride substrate. This effectively removes the silicon film as a source of cracks that otherwise could propagate downwardly into the silicon nitride substrate and significantly reduce its strength. 1 figure.

Inventors:
; ;
Issue Date:
OSTI Identifier:
7029064
Patent Number(s):
5022957
Application Number:
PPN: US 7-414906
Assignee:
University of Southern California, Los Angeles, CA (United States)
DOE Contract Number:  
AC05-84OR21400
Resource Type:
Patent
Resource Relation:
Patent File Date: 29 Sep 1989
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; SILICON NITRIDES; ETCHING; CRACK PROPAGATION; MECHANICAL PROPERTIES; REMOVAL; NITRIDES; NITROGEN COMPOUNDS; PNICTIDES; SILICON COMPOUNDS; SURFACE FINISHING; 360201* - Ceramics, Cermets, & Refractories- Preparation & Fabrication

Citation Formats

Copley, S M, Tao, H, and Todd-Copley, J A. Etching process for improving the strength of a laser-machined silicon-based ceramic article. United States: N. p., 1991. Web.
Copley, S M, Tao, H, & Todd-Copley, J A. Etching process for improving the strength of a laser-machined silicon-based ceramic article. United States.
Copley, S M, Tao, H, and Todd-Copley, J A. Tue . "Etching process for improving the strength of a laser-machined silicon-based ceramic article". United States.
@article{osti_7029064,
title = {Etching process for improving the strength of a laser-machined silicon-based ceramic article},
author = {Copley, S M and Tao, H and Todd-Copley, J A},
abstractNote = {A process is disclosed for improving the strength of laser-machined articles formed of a silicon-based ceramic material such as silicon nitride, in which the laser-machined surface is immersed in an etching solution of hydrofluoric acid and nitric acid for a duration sufficient to remove substantially all of a silicon film residue on the surface but insufficient to allow the solution to unduly attack the grain boundaries of the underlying silicon nitride substrate. This effectively removes the silicon film as a source of cracks that otherwise could propagate downwardly into the silicon nitride substrate and significantly reduce its strength. 1 figure.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1991},
month = {6}
}