Method of passivating semiconductor surfaces
Abstract
A method is described for passivating Group III-V or II-VI semiconductor compound surfaces. The method includes selecting a passivating material having a lattice constant substantially mismatched to the lattice constant of the semiconductor compound. The passivating material is then grown as an ultrathin layer of passivating material on the surface of the Group III-V or II-VI semiconductor compound. The passivating material is grown to a thickness sufficient to maintain a coherent interface between the ultrathin passivating material and the semiconductor compound. In addition, a device formed from such method is also disclosed.
- Inventors:
- Issue Date:
- OSTI Identifier:
- 7020250
- Patent Number(s):
- 4935384
- Application Number:
- PPN: US 7-284222
- Assignee:
- Dept. of Energy, Washington, DC (United States)
- DOE Contract Number:
- AC02-83CH10093
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 14 Dec 1988
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; 14 SOLAR ENERGY; SEMICONDUCTOR DEVICES; DESIGN; SEMICONDUCTOR MATERIALS; PASSIVATION; FABRICATION; LATTICE PARAMETERS; PROTECTIVE COATINGS; SOLAR CELLS; THIN FILMS; COATINGS; DIRECT ENERGY CONVERTERS; EQUIPMENT; FILMS; MATERIALS; PHOTOELECTRIC CELLS; PHOTOVOLTAIC CELLS; SOLAR EQUIPMENT; 360604* - Materials- Corrosion, Erosion, & Degradation; 360601 - Other Materials- Preparation & Manufacture; 140501 - Solar Energy Conversion- Photovoltaic Conversion
Citation Formats
Wanlass, M W. Method of passivating semiconductor surfaces. United States: N. p., 1990.
Web.
Wanlass, M W. Method of passivating semiconductor surfaces. United States.
Wanlass, M W. Tue .
"Method of passivating semiconductor surfaces". United States.
@article{osti_7020250,
title = {Method of passivating semiconductor surfaces},
author = {Wanlass, M W},
abstractNote = {A method is described for passivating Group III-V or II-VI semiconductor compound surfaces. The method includes selecting a passivating material having a lattice constant substantially mismatched to the lattice constant of the semiconductor compound. The passivating material is then grown as an ultrathin layer of passivating material on the surface of the Group III-V or II-VI semiconductor compound. The passivating material is grown to a thickness sufficient to maintain a coherent interface between the ultrathin passivating material and the semiconductor compound. In addition, a device formed from such method is also disclosed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1990},
month = {6}
}
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