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Title: Use of 2,5-dimethyl-2,5-hexane diamine as a curing agent for epoxy resins

Abstract

Primary diamines are disclosed of the formula shown in a diagram wherein R is a straight chain saturated hydrocarbon of 2 to 4 carbons, a disubstituted benzene ring, or disubstituted dibenzomethane for use as a curing agent for epoxy resins. These curing agents can be used to form epoxy resin mixtures useful in filament winding and pre-impregnated fiber molding and in formulating film adhesives, powder coatings and molding powders. The epoxy mixtures form for such uses as room temperature non-reacting, intermediate stable state which has a latent cross-linking capability.

Inventors:
;
Issue Date:
OSTI Identifier:
7005264
Patent Number(s):
4252936
Application Number:
PPN: US 6-005940
Assignee:
Dept. of Energy, Washington, DC (United States)
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Resource Relation:
Patent File Date: 24 Jan 1979
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 37 INORGANIC, ORGANIC, PHYSICAL AND ANALYTICAL CHEMISTRY; AMINES; CHEMICAL COMPOSITION; EPOXIDES; CURING; RESINS; ORGANIC COMPOUNDS; ORGANIC OXYGEN COMPOUNDS; ORGANIC POLYMERS; PETROCHEMICALS; PETROLEUM PRODUCTS; POLYMERS; 360601* - Other Materials- Preparation & Manufacture; 400201 - Chemical & Physicochemical Properties

Citation Formats

Rinde, J A, and Newey, H A. Use of 2,5-dimethyl-2,5-hexane diamine as a curing agent for epoxy resins. United States: N. p., 1981. Web.
Rinde, J A, & Newey, H A. Use of 2,5-dimethyl-2,5-hexane diamine as a curing agent for epoxy resins. United States.
Rinde, J A, and Newey, H A. Tue . "Use of 2,5-dimethyl-2,5-hexane diamine as a curing agent for epoxy resins". United States.
@article{osti_7005264,
title = {Use of 2,5-dimethyl-2,5-hexane diamine as a curing agent for epoxy resins},
author = {Rinde, J A and Newey, H A},
abstractNote = {Primary diamines are disclosed of the formula shown in a diagram wherein R is a straight chain saturated hydrocarbon of 2 to 4 carbons, a disubstituted benzene ring, or disubstituted dibenzomethane for use as a curing agent for epoxy resins. These curing agents can be used to form epoxy resin mixtures useful in filament winding and pre-impregnated fiber molding and in formulating film adhesives, powder coatings and molding powders. The epoxy mixtures form for such uses as room temperature non-reacting, intermediate stable state which has a latent cross-linking capability.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1981},
month = {2}
}

Patent:
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