skip to main content
DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Low temperature reactive bonding

Abstract

The joining technique is disclosed that requires no external heat source and generates very little heat during joining. It involves the reaction of thin multilayered films deposited on faying surfaces to create a stable compound that functions as an intermediate or braze material in order to create a high strength bond. While high temperatures are reached in the reaction of the multilayer film, very little heat is generated because the films are very thin. It is essentially a room temperature joining process. 5 figures.

Inventors:
;
Issue Date:
OSTI Identifier:
6883640
Patent Number(s):
5381944 A
Application Number:
PPN: US 8-145568
Assignee:
University of California, Oakland, CA (United States)
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Resource Relation:
Patent File Date: 4 Nov 1993
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; MATERIALS; BONDING; AMBIENT TEMPERATURE; JOINTS; LAYERS; THIN FILMS; FABRICATION; FILMS; JOINING; 360101* - Metals & Alloys- Preparation & Fabrication; 360201 - Ceramics, Cermets, & Refractories- Preparation & Fabrication; 360601 - Other Materials- Preparation & Manufacture

Citation Formats

Makowiecki, D M, and Bionta, R M. Low temperature reactive bonding. United States: N. p., 1995. Web.
Makowiecki, D M, & Bionta, R M. Low temperature reactive bonding. United States.
Makowiecki, D M, and Bionta, R M. Tue . "Low temperature reactive bonding". United States.
@article{osti_6883640,
title = {Low temperature reactive bonding},
author = {Makowiecki, D M and Bionta, R M},
abstractNote = {The joining technique is disclosed that requires no external heat source and generates very little heat during joining. It involves the reaction of thin multilayered films deposited on faying surfaces to create a stable compound that functions as an intermediate or braze material in order to create a high strength bond. While high temperatures are reached in the reaction of the multilayer film, very little heat is generated because the films are very thin. It is essentially a room temperature joining process. 5 figures.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1995},
month = {1}
}