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Title: Low temperature reactive bonding

The joining technique is disclosed that requires no external heat source and generates very little heat during joining. It involves the reaction of thin multilayered films deposited on faying surfaces to create a stable compound that functions as an intermediate or braze material in order to create a high strength bond. While high temperatures are reached in the reaction of the multilayer film, very little heat is generated because the films are very thin. It is essentially a room temperature joining process. 5 figures.
Inventors:
;
Issue Date:
OSTI Identifier:
6883640
Assignee:
University of California, Oakland, CA (United States) PTO; EDB-95-029158
Patent Number(s):
US 5381944; A
Application Number:
PPN: US 8-145568
Contract Number:
W-7405-ENG-48
Resource Relation:
Patent File Date: 4 Nov 1993
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; MATERIALS; BONDING; AMBIENT TEMPERATURE; JOINTS; LAYERS; THIN FILMS; FABRICATION; FILMS; JOINING 360101* -- Metals & Alloys-- Preparation & Fabrication; 360201 -- Ceramics, Cermets, & Refractories-- Preparation & Fabrication; 360601 -- Other Materials-- Preparation & Manufacture