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Title: Laminated insulators having heat dissipation means

Abstract

A laminated body is provided with heat dissipation capabilities. The insulator body is formed by dielectric layers interleaved with heat conductive layers, and bonded by an adhesive to form a composite structure. The heat conductive layers include provision for connection to an external thermal circuit.

Inventors:
; ;
Issue Date:
OSTI Identifier:
6867697
Assignee:
Dept. of Energy
DOE Contract Number:  
W-31-109-ENG-38
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; ELECTRICAL INSULATORS; HEAT TRANSFER; PRINTED CIRCUITS; DESIGN; OPERATION; THERMAL CONDUCTIVITY; ELECTRICAL EQUIPMENT; ELECTRONIC CIRCUITS; ENERGY TRANSFER; EQUIPMENT; PHYSICAL PROPERTIES; THERMODYNAMIC PROPERTIES; 420800* - Engineering- Electronic Circuits & Devices- (-1989)

Citation Formats

Niemann, R C, Mataya, K F, and Gonczy, J D. Laminated insulators having heat dissipation means. United States: N. p., 1980. Web.
Niemann, R C, Mataya, K F, & Gonczy, J D. Laminated insulators having heat dissipation means. United States.
Niemann, R C, Mataya, K F, and Gonczy, J D. Thu . "Laminated insulators having heat dissipation means". United States.
@article{osti_6867697,
title = {Laminated insulators having heat dissipation means},
author = {Niemann, R C and Mataya, K F and Gonczy, J D},
abstractNote = {A laminated body is provided with heat dissipation capabilities. The insulator body is formed by dielectric layers interleaved with heat conductive layers, and bonded by an adhesive to form a composite structure. The heat conductive layers include provision for connection to an external thermal circuit.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1980},
month = {4}
}