Laminated insulators having heat dissipation means
Abstract
A laminated body is provided with heat dissipation capabilities. The insulator body is formed by dielectric layers interleaved with heat conductive layers, and bonded by an adhesive to form a composite structure. The heat conductive layers include provision for connection to an external thermal circuit.
- Inventors:
- Issue Date:
- OSTI Identifier:
- 6867697
- Assignee:
- Dept. of Energy
- DOE Contract Number:
- W-31-109-ENG-38
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING; ELECTRICAL INSULATORS; HEAT TRANSFER; PRINTED CIRCUITS; DESIGN; OPERATION; THERMAL CONDUCTIVITY; ELECTRICAL EQUIPMENT; ELECTRONIC CIRCUITS; ENERGY TRANSFER; EQUIPMENT; PHYSICAL PROPERTIES; THERMODYNAMIC PROPERTIES; 420800* - Engineering- Electronic Circuits & Devices- (-1989)
Citation Formats
Niemann, R C, Mataya, K F, and Gonczy, J D. Laminated insulators having heat dissipation means. United States: N. p., 1980.
Web.
Niemann, R C, Mataya, K F, & Gonczy, J D. Laminated insulators having heat dissipation means. United States.
Niemann, R C, Mataya, K F, and Gonczy, J D. Thu .
"Laminated insulators having heat dissipation means". United States.
@article{osti_6867697,
title = {Laminated insulators having heat dissipation means},
author = {Niemann, R C and Mataya, K F and Gonczy, J D},
abstractNote = {A laminated body is provided with heat dissipation capabilities. The insulator body is formed by dielectric layers interleaved with heat conductive layers, and bonded by an adhesive to form a composite structure. The heat conductive layers include provision for connection to an external thermal circuit.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1980},
month = {4}
}
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