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Title: Apparatus and method for selective area deposition of thin films on electrically biased substrates

An ion beam deposition process for selective area deposition on a polarized substrate uses a potential applied to the substrate which allows the ionized particles to reach into selected areas for film deposition. Areas of the substrate to be left uncoated are held at a potential that repels the ionized particles. 3 figs.
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Issue Date:
OSTI Identifier:
Martin Marietta Energy Systems, Inc., Oak Ridge, TN (United States) PTO; EDB-94-166948
Patent Number(s):
US 5354583; A
Application Number:
PPN: US 7-972778
Contract Number:
Resource Relation:
Patent File Date: 9 Nov 1992
Country of Publication:
United States
36 MATERIALS SCIENCE; THIN FILMS; ENERGY BEAM DEPOSITION; ELECTRIC POTENTIAL; EQUIPMENT; SUBSTRATES; DEPOSITION; FILMS; SURFACE COATING 360101* -- Metals & Alloys-- Preparation & Fabrication; 360201 -- Ceramics, Cermets, & Refractories-- Preparation & Fabrication; 360601 -- Other Materials-- Preparation & Manufacture