Apparatus and method for selective area deposition of thin films on electrically biased substrates
Abstract
An ion beam deposition process for selective area deposition on a polarized substrate uses a potential applied to the substrate which allows the ionized particles to reach into selected areas for film deposition. Areas of the substrate to be left uncoated are held at a potential that repels the ionized particles. 3 figs.
- Inventors:
- Issue Date:
- OSTI Identifier:
- 6825221
- Patent Number(s):
- 5354583
- Application Number:
- PPN: US 7-972778
- Assignee:
- Martin Marietta Energy Systems, Inc., Oak Ridge, TN (United States)
- DOE Contract Number:
- AC05-84OR21400
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 9 Nov 1992
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; THIN FILMS; ENERGY BEAM DEPOSITION; ELECTRIC POTENTIAL; EQUIPMENT; SUBSTRATES; DEPOSITION; FILMS; SURFACE COATING; 360101* - Metals & Alloys- Preparation & Fabrication; 360201 - Ceramics, Cermets, & Refractories- Preparation & Fabrication; 360601 - Other Materials- Preparation & Manufacture
Citation Formats
Zuhr, R A, Haynes, T E, and Golanski, A. Apparatus and method for selective area deposition of thin films on electrically biased substrates. United States: N. p., 1994.
Web.
Zuhr, R A, Haynes, T E, & Golanski, A. Apparatus and method for selective area deposition of thin films on electrically biased substrates. United States.
Zuhr, R A, Haynes, T E, and Golanski, A. Tue .
"Apparatus and method for selective area deposition of thin films on electrically biased substrates". United States.
@article{osti_6825221,
title = {Apparatus and method for selective area deposition of thin films on electrically biased substrates},
author = {Zuhr, R A and Haynes, T E and Golanski, A},
abstractNote = {An ion beam deposition process for selective area deposition on a polarized substrate uses a potential applied to the substrate which allows the ionized particles to reach into selected areas for film deposition. Areas of the substrate to be left uncoated are held at a potential that repels the ionized particles. 3 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1994},
month = {10}
}
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