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Title: Apparatus and method for selective area deposition of thin films on electrically biased substrates

Abstract

An ion beam deposition process for selective area deposition on a polarized substrate uses a potential applied to the substrate which allows the ionized particles to reach into selected areas for film deposition. Areas of the substrate to be left uncoated are held at a potential that repels the ionized particles. 3 figs.

Inventors:
; ;
Issue Date:
OSTI Identifier:
6825221
Patent Number(s):
5354583 A
Application Number:
PPN: US 7-972778
Assignee:
Martin Marietta Energy Systems, Inc., Oak Ridge, TN (United States)
DOE Contract Number:  
AC05-84OR21400
Resource Type:
Patent
Resource Relation:
Patent File Date: 9 Nov 1992
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; THIN FILMS; ENERGY BEAM DEPOSITION; ELECTRIC POTENTIAL; EQUIPMENT; SUBSTRATES; DEPOSITION; FILMS; SURFACE COATING; 360101* - Metals & Alloys- Preparation & Fabrication; 360201 - Ceramics, Cermets, & Refractories- Preparation & Fabrication; 360601 - Other Materials- Preparation & Manufacture

Citation Formats

Zuhr, R A, Haynes, T E, and Golanski, A. Apparatus and method for selective area deposition of thin films on electrically biased substrates. United States: N. p., 1994. Web.
Zuhr, R A, Haynes, T E, & Golanski, A. Apparatus and method for selective area deposition of thin films on electrically biased substrates. United States.
Zuhr, R A, Haynes, T E, and Golanski, A. Tue . "Apparatus and method for selective area deposition of thin films on electrically biased substrates". United States.
@article{osti_6825221,
title = {Apparatus and method for selective area deposition of thin films on electrically biased substrates},
author = {Zuhr, R A and Haynes, T E and Golanski, A},
abstractNote = {An ion beam deposition process for selective area deposition on a polarized substrate uses a potential applied to the substrate which allows the ionized particles to reach into selected areas for film deposition. Areas of the substrate to be left uncoated are held at a potential that repels the ionized particles. 3 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1994},
month = {10}
}