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Title: Solderability test system

Abstract

A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time. 11 figs.

Inventors:
; ; ; ; ;
Issue Date:
Research Org.:
AT&T Corporation
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
675850
Patent Number(s):
5,827,951
Application Number:
PAN: 8-426,543
Assignee:
Sandia National Labs., Albuquerque, NM (United States) SNL; SCA: 426000; PA: EDB-99:003052; SN: 98002027979
DOE Contract Number:  
AC04-76DP00789
Resource Type:
Patent
Resource Relation:
Other Information: PBD: 27 Oct 1998
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; PRINTED CIRCUITS; SOLDERING; WELDABILITY; CAPILLARY FLOW; TESTING

Citation Formats

Yost, F., Hosking, F.M., Jellison, J.L., Short, B., Giversen, T., and Reed, J.R. Solderability test system. United States: N. p., 1998. Web.
Yost, F., Hosking, F.M., Jellison, J.L., Short, B., Giversen, T., & Reed, J.R. Solderability test system. United States.
Yost, F., Hosking, F.M., Jellison, J.L., Short, B., Giversen, T., and Reed, J.R. Tue . "Solderability test system". United States.
@article{osti_675850,
title = {Solderability test system},
author = {Yost, F. and Hosking, F.M. and Jellison, J.L. and Short, B. and Giversen, T. and Reed, J.R.},
abstractNote = {A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time. 11 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1998},
month = {10}
}