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Title: Package for integrated optic circuit and method

Abstract

A structure and method are disclosed for packaging an integrated optic circuit. The package comprises a first wall having a plurality of microlenses formed therein to establish channels of optical communication with an integrated optic circuit within the package. A first registration pattern is provided on an inside surface of one of the walls of the package for alignment and attachment of the integrated optic circuit. The package in one embodiment may further comprise a fiber holder for aligning and attaching a plurality of optical fibers to the package and extending the channels of optical communication to the fibers outside the package. In another embodiment, a fiber holder may be used to hold the fibers and align the fibers to the package. The fiber holder may be detachably connected to the package. 6 figs.

Inventors:
; ; ; ;
Issue Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
672725
Patent Number(s):
5790730
Application Number:
PAN: 8-336,902
Assignee:
SNL; SCA: 426000; PA: EDB-98:120789; SN: 98002026903
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Resource Relation:
Other Information: PBD: 4 Aug 1998
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; INTEGRATED CIRCUITS; PACKAGING; OPTICAL SYSTEMS; ALIGNMENT; FASTENING; OPTICAL FIBERS

Citation Formats

Kravitz, S H, Hadley, G R, Warren, M E, Carson, R F, and Armendariz, M G. Package for integrated optic circuit and method. United States: N. p., 1998. Web.
Kravitz, S H, Hadley, G R, Warren, M E, Carson, R F, & Armendariz, M G. Package for integrated optic circuit and method. United States.
Kravitz, S H, Hadley, G R, Warren, M E, Carson, R F, and Armendariz, M G. Tue . "Package for integrated optic circuit and method". United States.
@article{osti_672725,
title = {Package for integrated optic circuit and method},
author = {Kravitz, S H and Hadley, G R and Warren, M E and Carson, R F and Armendariz, M G},
abstractNote = {A structure and method are disclosed for packaging an integrated optic circuit. The package comprises a first wall having a plurality of microlenses formed therein to establish channels of optical communication with an integrated optic circuit within the package. A first registration pattern is provided on an inside surface of one of the walls of the package for alignment and attachment of the integrated optic circuit. The package in one embodiment may further comprise a fiber holder for aligning and attaching a plurality of optical fibers to the package and extending the channels of optical communication to the fibers outside the package. In another embodiment, a fiber holder may be used to hold the fibers and align the fibers to the package. The fiber holder may be detachably connected to the package. 6 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1998},
month = {8}
}