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Title: Adhesive bonding using variable frequency microwave energy

Abstract

Methods of facilitating the adhesive bonding of various components with variable frequency microwave energy are disclosed. The time required to cure a polymeric adhesive is decreased by placing components to be bonded via the adhesive in a microwave heating apparatus having a multimode cavity and irradiated with microwaves of varying frequencies. Methods of uniformly heating various articles having conductive fibers disposed therein are provided. Microwave energy may be selectively oriented to enter an edge portion of an article having conductive fibers therein. An edge portion of an article having conductive fibers therein may be selectively shielded from microwave energy. 26 figs.

Inventors:
; ; ; ;
Issue Date:
Research Org.:
Lockheed Martin Energy Syst Inc
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
672712
Patent Number(s):
5,798,395
Application Number:
PAN: 8-626,207
Assignee:
Lambda Technologies Inc., Raleigh, NC (United States); Lockheed Martin Energy Research Corp., Oak Ridge, TN (United States)
DOE Contract Number:  
AC05-84OR21400
Resource Type:
Patent
Resource Relation:
Other Information: PBD: 25 Aug 1998
Country of Publication:
United States
Language:
English
Subject:
32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION; ADHESION; ADHESIVES; BONDING; MANUFACTURING; MICROWAVE HEATING; CURING; TEMPERATURE CONTROL; JOINTS

Citation Formats

Lauf, R J, McMillan, A D, Paulauskas, F L, Fathi, Z, and Wei, J. Adhesive bonding using variable frequency microwave energy. United States: N. p., 1998. Web.
Lauf, R J, McMillan, A D, Paulauskas, F L, Fathi, Z, & Wei, J. Adhesive bonding using variable frequency microwave energy. United States.
Lauf, R J, McMillan, A D, Paulauskas, F L, Fathi, Z, and Wei, J. Tue . "Adhesive bonding using variable frequency microwave energy". United States.
@article{osti_672712,
title = {Adhesive bonding using variable frequency microwave energy},
author = {Lauf, R J and McMillan, A D and Paulauskas, F L and Fathi, Z and Wei, J},
abstractNote = {Methods of facilitating the adhesive bonding of various components with variable frequency microwave energy are disclosed. The time required to cure a polymeric adhesive is decreased by placing components to be bonded via the adhesive in a microwave heating apparatus having a multimode cavity and irradiated with microwaves of varying frequencies. Methods of uniformly heating various articles having conductive fibers disposed therein are provided. Microwave energy may be selectively oriented to enter an edge portion of an article having conductive fibers therein. An edge portion of an article having conductive fibers therein may be selectively shielded from microwave energy. 26 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1998},
month = {8}
}