Use of chemical mechanical polishing in micromachining
Abstract
A process for removing topography effects during fabrication of micromachines. A sacrificial oxide layer is deposited over a level containing functional elements with etched valleys between the elements such that the sacrificial layer has sufficient thickness to fill the valleys and extend in thickness upwards to the extent that the lowest point on the upper surface of the oxide layer is at least as high as the top surface of the functional elements in the covered level. The sacrificial oxide layer is then polished down and planarized by chemical-mechanical polishing. Another layer of functional elements is then formed upon this new planarized surface. 4 figs.
- Inventors:
- Issue Date:
- Research Org.:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- Sponsoring Org.:
- USDOE, Washington, DC (United States)
- OSTI Identifier:
- 672708
- Patent Number(s):
- 5804084
- Application Number:
- PAN: 8-729,122
- Assignee:
- Sandia Corp., Albuquerque, NM (United States)
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Resource Relation:
- Other Information: PBD: 8 Sep 1998
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; MICROELECTRONICS; ENGINES; FABRICATION; MINIATURIZATION; CHEMICAL POLISHING; MECHANICAL POLISHING; MACHINING
Citation Formats
Nasby, R D, Hetherington, D L, Sniegowski, J J, McWhorter, P J, and Apblett, C A. Use of chemical mechanical polishing in micromachining. United States: N. p., 1998.
Web.
Nasby, R D, Hetherington, D L, Sniegowski, J J, McWhorter, P J, & Apblett, C A. Use of chemical mechanical polishing in micromachining. United States.
Nasby, R D, Hetherington, D L, Sniegowski, J J, McWhorter, P J, and Apblett, C A. Tue .
"Use of chemical mechanical polishing in micromachining". United States.
@article{osti_672708,
title = {Use of chemical mechanical polishing in micromachining},
author = {Nasby, R D and Hetherington, D L and Sniegowski, J J and McWhorter, P J and Apblett, C A},
abstractNote = {A process for removing topography effects during fabrication of micromachines. A sacrificial oxide layer is deposited over a level containing functional elements with etched valleys between the elements such that the sacrificial layer has sufficient thickness to fill the valleys and extend in thickness upwards to the extent that the lowest point on the upper surface of the oxide layer is at least as high as the top surface of the functional elements in the covered level. The sacrificial oxide layer is then polished down and planarized by chemical-mechanical polishing. Another layer of functional elements is then formed upon this new planarized surface. 4 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1998},
month = {9}
}
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