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Title: Heat pipe with embedded wick structure

Abstract

A heat pipe has an embedded wick structure that maximizes capillary pumping capability. Heat from attached devices such as integrated circuits evaporates working fluid in the heat pipe. The vapor cools and condenses on a heat dissipation surface. The condensate collects in the wick structure, where capillary pumping returns the fluid to high heat areas. 7 figs.

Inventors:
; ; ; ;
Issue Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
672604
Patent Number(s):
5769154
Application Number:
PAN: 8-593,596
Assignee:
Sandia Corp., Albuquerque, NM (United States)
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Resource Relation:
Other Information: PBD: 23 Jun 1998
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; HEAT PIPES; CAPILLARY FLOW; HEAT PIPE WICKS; INTEGRATED CIRCUITS; HEAT TRANSFER; HEAT TRANSFER FLUIDS

Citation Formats

Adkins, D R, Shen, D S, Tuck, M R, Palmer, D W, and Grafe, V G. Heat pipe with embedded wick structure. United States: N. p., 1998. Web.
Adkins, D R, Shen, D S, Tuck, M R, Palmer, D W, & Grafe, V G. Heat pipe with embedded wick structure. United States.
Adkins, D R, Shen, D S, Tuck, M R, Palmer, D W, and Grafe, V G. Tue . "Heat pipe with embedded wick structure". United States.
@article{osti_672604,
title = {Heat pipe with embedded wick structure},
author = {Adkins, D R and Shen, D S and Tuck, M R and Palmer, D W and Grafe, V G},
abstractNote = {A heat pipe has an embedded wick structure that maximizes capillary pumping capability. Heat from attached devices such as integrated circuits evaporates working fluid in the heat pipe. The vapor cools and condenses on a heat dissipation surface. The condensate collects in the wick structure, where capillary pumping returns the fluid to high heat areas. 7 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1998},
month = {6}
}

Patent:
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