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Title: Composite material having high thermal conductivity and process for fabricating same

Abstract

A process is disclosed for fabricating a composite material such as that having high thermal conductivity and having specific application as a heat sink or heat spreader for high density integrated circuits. The composite material produced by this process has a thermal conductivity between that of diamond and copper, and basically consists of coated diamond particles dispersed in a high conductivity metal, such as copper. The composite material can be fabricated in small or relatively large sizes using inexpensive materials. The process basically consists, for example, of sputter coating diamond powder with several elements, including a carbide forming element and a brazeable material, compacting them into a porous body, and infiltrating the porous body with a suitable braze material, such as copper-silver alloy, thereby producing a dense diamond-copper composite material with a thermal conductivity comparable to synthetic diamond films at a fraction of the cost. 7 figs.

Inventors:
; ; ;
Issue Date:
Research Org.:
Univ. of California (United States)
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
672581
Patent Number(s):
5783316
Application Number:
PAN: 8-703,914
Assignee:
Univ. of California, Oakland, CA (United States)
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Resource Relation:
Other Information: PBD: 21 Jul 1998
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; FABRICATION; COMPOSITE MATERIALS; THERMAL CONDUCTIVITY; HEAT SINKS; INTEGRATED CIRCUITS; DIAMONDS; COPPER ALLOYS

Citation Formats

Colella, N J, Davidson, H L, Kerns, J A, and Makowiecki, D M. Composite material having high thermal conductivity and process for fabricating same. United States: N. p., 1998. Web.
Colella, N J, Davidson, H L, Kerns, J A, & Makowiecki, D M. Composite material having high thermal conductivity and process for fabricating same. United States.
Colella, N J, Davidson, H L, Kerns, J A, and Makowiecki, D M. Tue . "Composite material having high thermal conductivity and process for fabricating same". United States.
@article{osti_672581,
title = {Composite material having high thermal conductivity and process for fabricating same},
author = {Colella, N J and Davidson, H L and Kerns, J A and Makowiecki, D M},
abstractNote = {A process is disclosed for fabricating a composite material such as that having high thermal conductivity and having specific application as a heat sink or heat spreader for high density integrated circuits. The composite material produced by this process has a thermal conductivity between that of diamond and copper, and basically consists of coated diamond particles dispersed in a high conductivity metal, such as copper. The composite material can be fabricated in small or relatively large sizes using inexpensive materials. The process basically consists, for example, of sputter coating diamond powder with several elements, including a carbide forming element and a brazeable material, compacting them into a porous body, and infiltrating the porous body with a suitable braze material, such as copper-silver alloy, thereby producing a dense diamond-copper composite material with a thermal conductivity comparable to synthetic diamond films at a fraction of the cost. 7 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1998},
month = {7}
}