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Title: Methods for patterned deposition on a substrate

Abstract

A method is described for patterned depositions of a material onto a substrate. A surface of a polymeric substrate is first etched so as to form an etched layer having enhanced adhesions characteristics and then selected portions of the etched layer are removed so as to define a pattern having enhanced and diminished adhesion characteristics for the deposition of a conductor onto the remaining etched layer. In one embodiment, a surface of a PTFE substrate is chemically etched so as to improve the adhesion of copper thereto. Thereafter, selected portions of the etched surface are irradiated with a laser beam so as to remove the etched selected portions of the etched surface and form patterns of enhanced and diminished adhesion of copper thereto. 5 figures.

Inventors:
; ; ;
Issue Date:
OSTI Identifier:
6666135
Patent Number(s):
5380474 A
Application Number:
PPN: US 8-065211
Assignee:
Sandia Corporation, Albuquerque, NM (United States)
DOE Contract Number:  
AC04-76DP00789
Resource Type:
Patent
Resource Relation:
Patent File Date: 20 May 1993
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; COPPER; DEPOSITION; POLYMERS; SURFACE FINISHING; SUBSTRATES; ADHESION; ELECTRIC CONDUCTORS; ETCHING; ELEMENTS; METALS; TRANSITION ELEMENTS; 360101* - Metals & Alloys- Preparation & Fabrication; 360601 - Other Materials- Preparation & Manufacture

Citation Formats

Rye, R R, Ricco, A J, Hampden-Smith, M J, and Kodas, T T. Methods for patterned deposition on a substrate. United States: N. p., 1995. Web.
Rye, R R, Ricco, A J, Hampden-Smith, M J, & Kodas, T T. Methods for patterned deposition on a substrate. United States.
Rye, R R, Ricco, A J, Hampden-Smith, M J, and Kodas, T T. Tue . "Methods for patterned deposition on a substrate". United States.
@article{osti_6666135,
title = {Methods for patterned deposition on a substrate},
author = {Rye, R R and Ricco, A J and Hampden-Smith, M J and Kodas, T T},
abstractNote = {A method is described for patterned depositions of a material onto a substrate. A surface of a polymeric substrate is first etched so as to form an etched layer having enhanced adhesions characteristics and then selected portions of the etched layer are removed so as to define a pattern having enhanced and diminished adhesion characteristics for the deposition of a conductor onto the remaining etched layer. In one embodiment, a surface of a PTFE substrate is chemically etched so as to improve the adhesion of copper thereto. Thereafter, selected portions of the etched surface are irradiated with a laser beam so as to remove the etched selected portions of the etched surface and form patterns of enhanced and diminished adhesion of copper thereto. 5 figures.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1995},
month = {1}
}