Methods for patterned deposition on a substrate
Abstract
A method is described for patterned depositions of a material onto a substrate. A surface of a polymeric substrate is first etched so as to form an etched layer having enhanced adhesions characteristics and then selected portions of the etched layer are removed so as to define a pattern having enhanced and diminished adhesion characteristics for the deposition of a conductor onto the remaining etched layer. In one embodiment, a surface of a PTFE substrate is chemically etched so as to improve the adhesion of copper thereto. Thereafter, selected portions of the etched surface are irradiated with a laser beam so as to remove the etched selected portions of the etched surface and form patterns of enhanced and diminished adhesion of copper thereto. 5 figures.
- Inventors:
- Issue Date:
- OSTI Identifier:
- 6666135
- Patent Number(s):
- 5380474
- Application Number:
- PPN: US 8-065211
- Assignee:
- Sandia Corporation, Albuquerque, NM (United States)
- DOE Contract Number:
- AC04-76DP00789
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 20 May 1993
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; COPPER; DEPOSITION; POLYMERS; SURFACE FINISHING; SUBSTRATES; ADHESION; ELECTRIC CONDUCTORS; ETCHING; ELEMENTS; METALS; TRANSITION ELEMENTS; 360101* - Metals & Alloys- Preparation & Fabrication; 360601 - Other Materials- Preparation & Manufacture
Citation Formats
Rye, R R, Ricco, A J, Hampden-Smith, M J, and Kodas, T T. Methods for patterned deposition on a substrate. United States: N. p., 1995.
Web.
Rye, R R, Ricco, A J, Hampden-Smith, M J, & Kodas, T T. Methods for patterned deposition on a substrate. United States.
Rye, R R, Ricco, A J, Hampden-Smith, M J, and Kodas, T T. Tue .
"Methods for patterned deposition on a substrate". United States.
@article{osti_6666135,
title = {Methods for patterned deposition on a substrate},
author = {Rye, R R and Ricco, A J and Hampden-Smith, M J and Kodas, T T},
abstractNote = {A method is described for patterned depositions of a material onto a substrate. A surface of a polymeric substrate is first etched so as to form an etched layer having enhanced adhesions characteristics and then selected portions of the etched layer are removed so as to define a pattern having enhanced and diminished adhesion characteristics for the deposition of a conductor onto the remaining etched layer. In one embodiment, a surface of a PTFE substrate is chemically etched so as to improve the adhesion of copper thereto. Thereafter, selected portions of the etched surface are irradiated with a laser beam so as to remove the etched selected portions of the etched surface and form patterns of enhanced and diminished adhesion of copper thereto. 5 figures.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1995},
month = {1}
}