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Title: Methods for patterned deposition on a substrate

A method is described for patterned depositions of a material onto a substrate. A surface of a polymeric substrate is first etched so as to form an etched layer having enhanced adhesions characteristics and then selected portions of the etched layer are removed so as to define a pattern having enhanced and diminished adhesion characteristics for the deposition of a conductor onto the remaining etched layer. In one embodiment, a surface of a PTFE substrate is chemically etched so as to improve the adhesion of copper thereto. Thereafter, selected portions of the etched surface are irradiated with a laser beam so as to remove the etched selected portions of the etched surface and form patterns of enhanced and diminished adhesion of copper thereto. 5 figures.
Inventors:
; ; ;
Issue Date:
OSTI Identifier:
6666135
Assignee:
Sandia Corporation, Albuquerque, NM (United States) SNL; EDB-95-029161
Patent Number(s):
US 5380474; A
Application Number:
PPN: US 8-065211
Contract Number:
AC04-76DP00789
Resource Relation:
Patent File Date: 20 May 1993
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; COPPER; DEPOSITION; POLYMERS; SURFACE FINISHING; SUBSTRATES; ADHESION; ELECTRIC CONDUCTORS; ETCHING; ELEMENTS; METALS; TRANSITION ELEMENTS 360101* -- Metals & Alloys-- Preparation & Fabrication; 360601 -- Other Materials-- Preparation & Manufacture

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